Browsing by Author "Huang, Chia-Sheng"

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Investigation of Ni-based thermal bimaterial structure for sensor and actuator application
(2009-02-16)
Huang, Chia-Sheng
;
Cheng, Yu-Ting
;
Chung, Junwei
;
Hsu, Wensyang
;
機械工程學系
Thermal bimaterial structures made of Ni and Ni-diamond nanocomposite for sensor and actuator application are proposed, fabricated, and tested. Two deflection types of thermal bimaterial structures, including upward and downward bending types, can be easily fabricated by controlling electroplating sequence of Ni and Ni-diamond nanocomposite. According to thermal performance measurement, the tip deflection of upward and downward types can reach about 82.5 mu m and -22.5 mu m for a temperature change of 200 degrees C, respectively. In the condition, the thermomechanical sensitivity and Output force are 412.5 nm/K and 97.0 mu N for upward type thermal bimaterial structure: and -112.5 nm/K and -26.5 mu N for downward type one. Due to the low electroplating process temperature (similar to 50 degrees C) for both Ni-based layers, diminutive pre-deformation of as-fabricated structure and strong interlaminar bonding strength are verified by SEM and vibrational test. The resonant frequency of the structure remains unchanged after 10(9) cycles. (C) 2008 Elsevier B.V. All rights reserved.
Thermal bimetallic microactuators by Ni and Ni-diamond nanocomposite
(2007)
Huang, Chia-Sheng
;
Chung, Junwei
;
Cheng, Yu-Ting
;
Hsu, Wensyang
;
機械工程學系
In previous investigation, it was found that Ni-diamond nanocomposite fabricated by adding nano-diamond particles in nickel plating could enhance coefficient of thermal expansion (CTE). Here thermal bimetallic microactuators made of Ni and Ni-diamond nanocomposite are proposed, fabricated, and tested. By controlling plating sequence of Ni and Ni-diamond nanocomposite, two types of the thermal bimetallic microactuators, including upward displacement and downward displacement types, are developed. Due to the same low process temperature in electroplating these two layers, the residual thermal stress and initial deformation of. fabricated thermal bimetallic microactuators are small. Since two materials in the bimetallic actuators are Ni-based, the bonding strength between Ni and Ni-diamond nanocomposite is found to be strong. From vibration test, after 109 cycles, the resonant frequency remains unchanged. From thermal cycling test, the fabricated thermal bimetallic microactuator shows good interfacial bonding strength with only 0.002 % deviation of resonant frequency and 13.5 % deviation of tip deflection after 1,000 continuous thermal cycles.