Browsing by Author "Huang, PW"

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Droplets oscillation and continuous pumping by asymmetric electrowetting
(2006)
Wang, TT
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Huang, PW
;
Fan, SK
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材料科學與工程學系奈米科技碩博班
;
Graduate Program of Nanotechnology , Department of Materials Science and Engineering
This paper reports a new approach to digital microfluidic systems based on asymmetric electrowetting-on-dielectric (AEWOD) mechanism. On the AEWOD device, droplets can be oscillated or continuously pumped on an open surface by none or limited control electric circuits. This paper presents: (1) the AEWOD phenomenon, (2) droplet oscillation controlled by AEWOD force, and (3) the demonstration of unidirectional and bidirectional droplet pumping on AEWOD device.
Study on pressure-independent Cu removal in Cu abrasive-free polishing
(2006)
Fang, JY
;
Huang, PW
;
Tsai, MS
;
Dai, BT
;
Wu, YS
Pattern effect, a critical issue in metal planarization, results from different pattern designs bringing a variation of effective local pressure. In order to optimize the pattern effect in Cu planarization, Cu removal should be pressure independent. Recently, it was found that Cu abrasive-free polishing (AFP) technology could benefit pressure-independent Cu removal for Cu planarization by controlling the down force. In this study, by using 5-methyl-1H-benzotriazole as a corrosion inhibitor, pressure-independent Cu removal with AFP slurries can be achieved below a 3 psi down force. Thus, the pattern effect in Cu planarization can be optimized with AFP slurries by low down force. (c) 2005 The Electrochemical Society. [DOI: 10.1149/1.2137469] All rights reserved.