Browsing by Author "Huang, RG"

Now showing 1 - 4 of 4

Ambipolar Schottky-barrier TFTs
(2002-02-01)
Lin, HC
;
Yeh, KL
;
Huang, TY
;
Huang, RG
;
Sze, SM
A novel Schottky-barrier metal-oxide-semiconductor thin-film transistor (SBTFT) was successfully demonstrated and characterized. The new SBTFT device features a fleld-induced-drain (FID) region, which is controlled by a metal field-plate lying on top of the passivation oxide. The FED region is sandwiched between the silicided drain and the active channel region. Carrier types and the conductivity of the transistor are controlled by the metal field-plate. The device is thus capable of ambipolar operation. Excellent ambipolar performance with on/off current ratios over 10(6) for both p- and n-channel operations was realized simultaneously on the same device fabricated with polysilicon active layer. Moreover, the off-state leakage current shows very weak dependence on the gate-to-drain voltage difference with the FID structure. Finally, the effects of FED length are explored.
Conduction mechanisms for off-state leakage current of Schottky barrier thin-film transistors
(2001-07-30)
Yeh, KL
;
Lin, HC
;
Huang, RG
;
Tsai, RW
;
Huang, TY
Conduction mechanisms for the off-state leakage in Schottky barrier thin-film transistor were explored. It was found that the field-emission process dominates the leakage conduction of the device with the conventional structure as the field strength in the drain junction becomes high, and results in the strong gate-induced drain leakage (GIDL) like phenomenon. In contrast, for the device with a field-induced-drain structure, the high-field region is pulled away from the silicided drain. As a result, the field-emission conduction is eliminated, so the GIDL-like leakage current is effectively suppressed. (C) 2001 American Institute of Physics.
Reduction of off-state leakage current in Schottky barrier thin-film transistors (SBTFT) by a field-induced drain
(2002-04-01)
Yeh, KL
;
Lin, HC
;
Huang, RG
;
Tsai, RW
;
Huang, TY
Detailed conduction mechanisms in a conventional Schottky barrier thin-film transistor (SBTFT) and a recently proposed novel SBTFT with field-induced drain (FID) extension have been studied. The new SBTFT device with FID extension shows excellent ambipolar performance with effective suppression of gate-induced drain leakage (GIDL)-like off-state leakage that plagues conventional SBTFT devices. By characterizing the activation energy of the conduction process in the off-state for conventional SBTFT devices, it is suggested that field emission of carriers from the drain junction is the major conduction mechanism. While for the FID SBTFT devices, owing to the effect of Fermi level pinning in the FID region, thermionic emission rather than field emission becomes the dominant conduction mechanism, resulting in the effective suppression of the undesirable GIDL-like leakage current.
Schottky barrier thin-film transistor (SBTFT) with silicided source/drain and field-induced drain extension
(2001-04-01)
Lin, HC
;
Yeh, KL
;
Huang, RG
;
Lin, CY
;
Huang, TY
A novel Schottky barrier thin-film transistor (SBTFT) with silicided source/drain and field-induced drain (FID) extension is proposed and demonstrated. In the new device configuration, a metal field-plate (or sub-gate) lying on the passivation oxide is employed to induce a sheet of carriers in a channel offset region located between the silicided drain and the active channel region underneath the main-gate. The new device thus allows ambipolar device operation by simply switching the polarity of the bias applied to the field plate. In contrast to the conventional SBTFT that suffers from high GIDL (gate-induced drain leakage)-like off-state leakage current, the new SBTFT with FID is essentially free from the GIDL-like leakage current. In addition, unlike the conventional SBTFT that suffers from the low on-off current ratio, the new device exhibits high on/off current ratio up to 10(6) for both n- and p-channel modes of operation. Moreover, the implantless feature and the ambipolar capability of the new device also result in extra low mask count for CMOS processes integration. These excellent device characteristics, coupled with its simple processing, make the new device very promising for future large-area electronic applications.