Browsing by Author "Huang, Tai-Yuan"

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Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
(2017-01-01)
Yang, Yu-Tao
;
Yu, Ting-Yang
;
Kuo, Shu-Chiao
;
Huang, Tai-Yuan
;
Yang, Kai-Ming
In this paper, finite element method (FEM) simulations are carried out with pillar-concave structure using silicon substrate, silicon substrate with polyimide (PI) and with polybenzoxazole (PBO) for realization of Cu-Cu bonding at low temperature. Parameters of bonding temperature, pillar diameter, concave sidewall angle, and multilayer of concave structure are all considered in simulation. In addition, pillarconcave bonding is successfully demonstrated on silicon substrates with bonding temperatures ranging from 60 degrees C to 100 degrees C. Simulation and fabrication results of concept show potential impacts on current semiconductor packaging method with advantages such as high adhesive strength of polymer on various types of substrates, simplified manufacturing process, solder free interconnect and packaging process, Cu-Cu direct bonding at temperature lower than 100 degrees C, and high tolerance in surface roughness.
Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration
(2017-09-01)
Yang, Yu-Tao
;
Chou, Tzu-Chieh
;
Yu, Ting-Yang
;
Chang, Yu-Wei
;
Huang, Tai-Yuan
Low-temperature Cu-Cu bonding utilizing pillar and concave on silicon substrate with and without polymer layer is successfully implemented at 200 degrees C under atmospheric pressure. Finite-element method (FEM) simulations on stress and deformation generated during bonding process are also presented in order to discuss their influence on bonding result of several pillar diameters and of concave sidewall angles originating from the manufacturing process. The alteration of parameters in FEM simulations would also be investigated to enhance the bonding outcome. The parameters include the diameter of pillar, the sidewall angle of concave, the shape of the concave opening, the addition of extra polymer layer under Cu concave layer, the bonding temperature, and the pitch of the pillar-concave structure. The implementation of Cu-Cu bonding using pillar-concave structure could have a prospective effect on existing packaging methods in semiconductor industry with benefits of applicability to various sorts of substrates and low bonding temperature.