Browsing by Author "Huang, YM"

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Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow
(2004-12-01)
Shao, TL
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Chen, TS
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Huang, YM
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Chen, C
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材料科學與工程學系
While the dimension of solder bumps keeps shrinking to meet higher performance requirements, the formation of interfacial compounds may be affected more profoundly by the other side of metallization layer due to a smaller bump height. In this study, cross interactions on the formation of intermetallic compounds (IMCs) were investigated in eutectic SnPb, SnAg3.5, SnAg3.8Cu0.7, and SnSb5 solders jointed to Cu/Cr-Cu/Ti on the chip side and Au/Ni metallization on the substrate side. It is found that the Cu atoms on the chip side diffused to the substrate side to form (Cu-x,Ni1-x)(6)Sn-5 or (Ni-y,Cu1-y)(3)Sn-4 for the four solders during the reflow for joining flip chip packages. For the SnPb solder, Au atoms were observed on the chip side after the reflow, yet few Ni atoms were detected on the chip side. In addition, for SnAg3.5 and SnSn5 solders, the Ni atoms on the substrate side migrated to the chip side during the reflow to change binary Cu6Sn5 into ternary (Cu-x,Ni1-x)(6)Sn-5 IMCs, in which the Ni weighed approximately 21%. Furthermore, it is intriguing that no Ni atoms were detected on the chip side of the SnAg3.8Cu0.7 joint. The possible driving forces responsible for the diffusion of Au, Ni, and Cu atoms are discussed in this paper.
Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.86b0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization
(2006-06-29)
Hsu, YC
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Huang, YM
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Chen, C
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Wang, H
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材料科學與工程學系
This study investigates the metallurgical reaction and shear strength of Pb-free SnAg2.5Cu0.8Sb0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization pads. It is found that (Cu,Ni)(6)Sn-5 intermetallic compound (IMC) formed at the interface between the Sn2.5Ag0.8Cu0.5Sb solder and the metallization pad; whereas (Cu,Ni)(6)Sn-5 and (Ni,Cu)(3)Sn-4 IMCs formed when the SnAg3.0Cu0.5Sb0.2 reacted with the Au/Ni(P) metallization pad. The difference in the Cu concentration in the two solders may be responsible for the different interfacial IMC formation. The shear strengths for the SnAg2.5Cu0.8Sb0.5, SnAg3.0Cu0.5Sb0.2, SnAg3.0Cu0.5, and SnAg4.0Cu0.5 solders were also measured. The shear strength test revealed that the SnAg2.5Cu0.8Sb0.5 solder has the highest shear strength, which may be due to the solid-solution strengthening of the Sb atoms. (c) 2005 Elsevier B.V. All rights reserved.
Mechanisms linking employee affective delivery and customer behavioral intentions
(2002-10-01)
Tsai, WC
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Huang, YM
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經營管理研究所
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Institute of Business and Management
Past empirical evidence has indicated that employee affective delivery can influence customer reactions (e.g., customer satisfaction, service quality evaluation). This study extends previous research by empirically examining mediating processes underlying the relationship between employee affective delivery and customer behavioral intentions. Data were collected from 352 employee-customer pairs in 169 retail shoe stores in Taiwan. Results showed that the influence of employee affective delivery on customers' willingness to return to the store and pass positive comments to friends was indirect through the mediating processes of customer in-store positive moods and perceived friendliness. The study also indicated that employee affective delivery influences customers' time spent in store, which, in turn, influences customer behavioral intentions.
Multiple-objective planning for a production and distribution model of the supply chain: Case of a bicycle manufacturer
(2006-04-01)
Tzeng, GH
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Tang, TI
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Huang, YM
;
Chang, ML
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科技管理研究所
The bicycle industry is one of the most competitive industries in Taiwan. To construct multi-objective production and distribution models tor supply chain, following five methods are compared and discussed: (i) Multi-objective compromise programming; (ii) Fuzzy multi-objective programming (iii) Weighted multi-objective programming; (iv) Weighted fuzzy multi-objective programming; and (v) Two-phase fuzzy multi- objective programming. The weighted multi-objective model has been found better for considering the maximum profit for enterprises and the maximum quality for customer service. After raising the per-unit production cost in production processes, it was observed that the total profit would decrease in real empirical study. In addition, if the unit inventory cost increases due to improving the customer service level, then the total profit might increase, but not significantly.