Browsing by Author "Huang, Yen-Jun"

Now showing 1 - 5 of 5

Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric
(2016-07)
Huang, Yen-Jun
;
Hsieh, Yen-Hui
;
Shih, Jian-Yu
;
Chen, Han-Chun
;
Leu, Jihperng
This study examines the metal/polymer interfacial adhesion strength for Cu, Ti and three polymers, BCB, SU-8 and AZ 4620. Detailed discussion and explanation focused on adhesion mechanism between metal and BCB, AZ 4620 dielectric are provided. The adhesion strengths of metal on polymer layer are measured by four point bending (FPB) test, which showed that copper and titanium have different characteristics in metal-polymer adhesion. Additionally, to figure out the interfacial adhesion mechanisms, X-ray photoelectron spectroscopy (XPS) technique is used to investigate the chemical bonding compositions between interfaces. The results indicate that the adhesion strength is enhanced by the intense reaction between metal and oxygen on the polymer main chain at the metal-polymer interfaces. On the other hand, interfacial adhesion strength is weaken owing to the destruction of polymer structure, thus the bonding between metal and polymer-main-chain debonded oxygen are of no effect on adhesion.
Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration Applications
(2017-01-01)
Huang, Yen-Jun
;
Chen, Hsiu-Chi
;
Yu, Ting-Yang
;
Lai, Bo-Hung
;
Shih, Yu-Chiao
In this work, hybrid bonding platform is successfully developed with solder bonding and photosensitive polyimide (PI) at 250 degrees C. Since solder may be affected by the curing process of polymer owing to its low melting point; an asymmetry hybrid bonding structure is proposed to overcome this issue. Metal and polymer can be well bonded simultaneously with wide integration flexibility through various ratios of polymer to metal. The mechanical strength of bonded structure is substantially improved with the better use of polymer filling in the extra areas between metal lines. The developed hybrid bonding structure shows excellent electrical characteristics and high wafer level uniformity. Furthermore, the bonded samples also show excellent reliability to endure temperature variation and humidity erosion after temperature cycling test and un-bias highly accelerated stress test. With the advantages of dielectric photosensitivity, excellent bonding qualities, high process flexibilities, strong mechanical strength, good electrical pertbrmance and high stability, the hybrid bonding structures have the outstanding potential to be used in future 3D heterogeneous applications.
Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration Applications
(2017-01-01)
Chen, Hsiu-Chi
;
Kho, Yi-Tung
;
Huang, Yen-Jun
;
Hsieh, Yu-Sheng
;
Chang, Yao-Jen
In this work, a particular ultra-thin buffer layer (UBL) with various thickness ranging from 10 nm to 100 nm and different materials including Co, Ni, Pd and Ti is inserted between Cu/Sn to delay the interdiffusion prior to eutectic bonding. The efficacy of the buffer layer and the bonding quality are systematically conferred using microstructure imaging, material analysis, and electrical performance. In addition to symmetric Cu/Sn bonding with UBL, an asymmetric Cu/Sn-Cu bonding which is proposed to relieve the heat enhanced interdiffUsion issues thereby enhancing the reliability performance is demonstrated with the assistance of UBL technology.
Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface
(2018-02-01)
Hsieh, Yen-Hui
;
Huang, Yen-Jun
;
Shih, Jian-Yu
;
Leu, Jihperng
;
Chen, Kuan-Neng
A method is built for describing the relationship between adhesion strength and chemical states of Co/polymer and Cr/polymer interfaces. Based on the chemical bonding model, the adhesion strength is confirmed to be dominated by the metal organic complex at the interfaces. For Cr/polymers interfaces, the formation of metal-organic complex is restricted by the oxidation of metal atoms during deposition, which leads to almost no variation in adhesion from low [benzocyclobutene(BCB)] to high (AZ 4620) oxygenated polymers. On the other hand, a strong adhesion is observed at the Co/BCB interface that arises from the metal-organic bonds associated with hydroxyl groups in the polymer. The method is expected to provide clear analysis to other metal-polymer interfaces for seeking proper combination in heterogeneous integration.
Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D Integration
(2017-01-01)
Lu, Cheng-Hsien
;
Kho, Yi-Tung
;
Cheng, Chuan-An
;
Huang, Yen-Jun
;
Chen, Kuan-Neng
Hybrid bonding is one of the key technologies in 3D IC integration, which can integrate various functional chips using vertical interconnection to reduce RC delay and realize heterogeneous integration by bonding process. Conventional hybrid bonding uses oxide layer as the filling material between the metal interconnect, which can prevent oxidation of metal layer and enhance the bonding strength. However, there are some issues of oxide layer such as its poor stress absorption and the demand of surface flatness. Polymer is the potential material to replace oxide as hybrid bonding material because of its stress release property and better surface roughness tolerance. This paper investigates the adhesion properties of polymer and passivation layer and demonstrates perfect polymer-to-polymer wafer-level bonding results.