Browsing by Author "Huang, Yu Wen"

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Power consumption reduction scheme of magnetic microactuation using electroplated Cu-Ni nanocomposite
(2007-06-11)
Huang, Yu Wen
;
Chao, Yuan
;
Chen, C. C.
;
Cheng, Y. T.
;
電子工程學系及電子研究所
This letter presents a power consumption reduction scheme of magnetic microactuation using Cu-Ni nanocomposite film which is electroplated in alkaline noncyanide based Ni colloidal copper plating solution at 40 degrees C. The superconducting quantum interference device magnetometer measurements show that Cu film is modified from diamagnetism to ferromagnetism via the incorporation of Ni ferromagnetic nanoparticles into itself to form a Cu-Ni nanocomposite film. A magnetic microactuator made of the nanocomposite can have about 9% performance improvement in terms of actuation enlargement. In other words, the coil made of the Cu-Ni nanocomposite can exhibit better power efficiency for the same output displacement. (c) 2007 American Institute of Physics.
SYNTHESIS AND DEVICE FABRICATION OF CU-NI NANOCOMPOSITE FOR LOW POWER MAGNETIC MICROACTUATION
(2007)
Huang, Yu Wen
;
Chao, Tzu-Yuan
;
Cheng, Y. T.
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
This paper presents a Cu-Ni nanocomposite film and related CMOS compatible fabrication process using alkaline noncyanide based copper plating solution for low power magnetic microactuation application. The magnetic properties of Cu can be modified from diamagnetism to ferromagnetism via the incorporation of Ni nanoparticles into a Cu matrix to form a Cu-Ni nanocomposite film. Experimental results show that about 9% power consumption reduction of magnetic microactuation could be realized while the actuated coil is made of the Cu-Ni nanocomposite instead of pure Cu. The effective power reduction can be attributed to the magnetic flux density intensification inside the coil.