Browsing by Author "Hwang, Bang-Ning"
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Item type:Item, Key Consideration Factors of Adopting Cloud Computing for Science(2012) ;Yang, Chia-Lee ;Hwang, Bang-Ning ;Yuan, Benjamin J. C. ;科技管理研究所Institute of Management of TechnologyThe scientific projects are characterized of requiring high performance computing resources, complex configuration environment, and massive storage. Compared with the traditional grid computing that has been employed by scientific projects for decades, the emerging cloud computing technology offers scientists an alternative of acceptable computing performance and massive storage required with lower infrastructure construction cost and more elastic and flexible system extendibility. Despite these enticing benefits and growing interest of exercising science cloud, there exist uncertainties and challenges that barricade the wide adoption of cloud computing in the scientific field. The goal of this paper is to identify the key consideration factors of adopting cloud computing for science and explore the interrelationship among them. We first developed a comprehensive hierarchy of consideration factors comprising four dimensions and ten underlying factors. Subsequently, we conducted an in-depth survey and interview of 22 domain experts who were actively involved in constructing Taiwan national science clouds. The surveyed data was finally analyzed by employing Decision Making Trial and Evaluation Laboratory (DEMATEL) technique to explore the influential network relationship of these consideration factors. Our findings suggest that Cost, Networking, and Elasticity are the top three dominant factors influencing the adoption of cloud computing for science.Item type:Item, Pioneering e-supply chain integration in semiconductor industry: a case study(2008-03-01) ;Hwang, Bang-Ning ;Chang, Shih-Chi ;Yu, Hsiao-Cheng ;Chang, Che-Wei交大名義發表Taiwan Semiconductor Manufacturing Company (TSMC) is the largest semiconductor foundry in the world. Advanced Semiconductor Engineering Inc. (ASE) is the world's leader in semiconductor assembly and testing. From 1998 to 2004, the two companies completed electronic integration of I I key business processes through the Internet. The result is a seamless interface between TSMC, ASE and their joint customers. They can now obtain accurate, timely information on their product status and respond appropriately when needed. While the direct economic benefits are estimated to be around US$ 10 million through productivity increase over a total investment of about US$ 2 million, the indirect benefits of this initiative could be on the order of US $100 million if the joint customers' benefits are considered. In collaboration with the RosettaNet organization, TSMC and ASE leveraged their pioneering experiences to define three data exchange standards which can then be widely adopted in the semiconductor industry. This case study is a demonstration of how two leading companies in their respective fields can join forces to make a difference in creating value for the entire semiconductor industry, which in turn benefits society at large. With the momentum continuing to build and the sphere of influence continuing to expand, it is anticipated that TSMC, ASE and the entire sector will upgrade their competitiveness in terms of cost, quality, responsiveness and customer orientation.