Browsing by Author "Jenq, Shrane Ning"

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Tapered Cu pattern metallization by electrodeposition through mask
(2006)
Jenq, Shrane Ning
;
Wan, Chi Chao
;
Wang, Yung Yun
;
Li, Hung Wei
;
Liu, Po Tsun
A tapered shape of Cu pattern by electrodeposition through mask is preferred for fabricating metal line on thin-film transistors (TFTs). The influence of individual organic additive [polyethylene glycol (PEG), bis-3-sodiumsulfopropyl disulfide (SPS)] on the sidewall shape of the Cu pattern was identified. A compromising effect shows up when both PEG and SPS are added owing to the competition of the behavior of two different organic additives during Cu electrodeposition. Therefore, a method has been developed for the fabrication of copper pattern used in TFTs, which forms a tapered pattern in one single Cu deposition step. (c) 2006 The Electrochemical Society.