Browsing by Author "Jiang, IHR"
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Item type:Item, Crosstalk-driven interconnect optimization by simultaneous gate and wire sizing(2000-09-01) ;Jiang, IHR ;Chang, YW ;Jou, JY ;資訊工程學系電子工程學系及電子研究所Noise, as well as area, delay, and power, is one of the most important concerns in the design of deep submicrometer integrated circuits. Currently existing algorithms do not handle simultaneous switching conditions of signals for noise minimization. In this paper, we model not only physical coupling capacitance, but also simultaneous switching behavior for noise optimization. Based on Lagrangian relaxation, we present an algorithm which ran optimally solve the simultaneous noise, area, delay, and power optimization problem by sizing circuit components. Our algorithm, with linear memory requirement and linear runtime, is very effective and efficient. For example, for a circuit of 6144 wires and 3512 gates, our algorithm solves the simultaneous optimization problem using only 2.1-MB memory and 19.4-min runtime to achieve the precision of within 1% error on a SUN Spare Ultra-I workstation.Item type:Item, Internet-based hierarchical floorplan design(1999-11-01) ;Lin, JH ;Jou, JY ;Jiang, IHR ;電子工程學系及電子研究所Department of Electronics Engineering and Institute of ElectronicsWith the proliferation of the transistor count in VLSI design, more and more design groups try to figure out an efficient way to combine their designs. The Internet features distributed computing and resource sharing. Consequently, a hierarchical design can adequately be solved in the Internet environment. In this paper, we demonstrate the facilitation of the Internet environment by solving the area minimization floorplan problem. We propose the RMG algorithm taking advantage of the Internet. Based on the model of transfer latencies, the RMG algorithm reduces the computing time by shortening the critical path in the floorplan tree. Our experimental results show that the Internet is suitable for Electronic Design Automation (EDA).Item type:Item, On placement and routing of wafer scale memory(2001) ;Sung, LA ;Jiang, IHR ;Chang, YW ;Jou, JYWu, JCThe progress of computer technology triggers the requirement of high speed and large volume memory. In modern manufacturing, a memory module is integrated by packaged memory chips on a printed circuit board. This paper proposes two architectures directly to integrate a memory module at the wafer level before packaging. This method can reduce the area, enhance the performance, and save the packaging cost. A polynomial time algorithm is presented to find the placement that minimizes the critical delay of the module. The routing is subsequently applied, and laser cutting technology is adopted to remove the unnecessary connections. Experimental results show that our approaches are very efficient and effective. A 64 Mx128 bit module is completed in 348.38 second runtime and 4664 KB memory, and the delay is improved 88.67%.Item type:Item, Reliable crosstalk-driven interconnect optimization(2006-01-01) ;Jiang, IHR ;Pan, SR ;Chang, YW ;Jou, JY電子工程學系及電子研究所As technology advances apace, crosstalk becomes a design metric of comparable importance to area and delay. This article focuses mainly on the crosstalk issue, specifically on the impacts of physical design and process variation on crosstalk. While the feature size shrinks below 0.25 mu m, the impact of process variation on crosstalk increases rapidly. Hence, a crosstalk insensitive design is desirable in the deep submicron regime. In this article, crosstalk sensitivity is referred to as the influence of process variation on crosstalk in a circuit. We show that the lower bound of crosstalk sensitivity grows quadratically, while that of crosstalk increases linearly. Therefore, designers should also consider crosstalk sensitivity, when optimizing other design objectives such as crosstalk, area, and delay. According to our modeling, these objectives are all in posynomial forms, and thus the multiobjective optimization problem can optimally be solved by Lagrangian relaxation. Experimental results show that our method is effective and efficient. For instance, a circuit of 2856 gates and 5272 wires is optimized using 13-minute runtime and 2.8-MB memory on a Pentium III 1.0 GHz PC with 256-MB memory. In particular, by relaxing Lagrange multipliers to the critical paths, it takes only two iterations for all solutions to converge to the global optimal, which is much more efficient than related previous work. This relaxation scheme provides a key insight into the rapid convergence in Lagrangian relaxation.Item type:Item, Simultaneous floorplan and buffer-block optimization(2004-05-01) ;Jiang, IHR ;Chang, YW ;Jou, JY ;Chao, KY電子工程學系及電子研究所As technology advances and the number of interconnections among modules rapidly increases, timing closure, and design convergence are the most important concerns. Hence, it is desirable to consider interconnect optimization as early as possible. Previous work for this issue can be classified into two directions: wire planning and buffer-block planning for interconnect-driven. floorplanning. Wire planning for interconnect-driven floorplanning does not consider buffer insertion, and buffer-block planning for interconnect-driven floorplanning cannot overcome the limitation of a bad initial floorplan. In this paper, we first address simultaneous floorplanning and buffer-block planning (i.e., integrating buffer-block planning into floorplanning) for interconnect optimization. We adopt simulated annealing to refine a floorplan so that buffers can be inserted more effectively. In each iteration, we construct a routing tree for each net, allocate buffers for all nets, introduce corresponding buffer blocks into the intermediate floorplan, and invoke Lagrangian relaxation to optimize area and satisfy timing requirements. Further, in order to reduce the problem size, we present supermodule partitioning which partitions modules into supermodules. Experimental results show that our method of integrating buffer-block planning into floorplanning can significantly improve the interconnect delay and reduce the number of buffers needed. Based on a set of MCNC benchmark circuits, our approach achieves an average success rate of 86.1% of nets meeting timing constraints, inserts only 272 buffers on average, and consumes an average extra area of only 0.28% over the given floorplan, compared with the average success rate of 62.6%, 1123 buffers, and extra area of 1.05% resulted from a famous recent work presented at ICCAD'99.