Browsing by Author "KUO, JT"

Now showing 1 - 4 of 4

A TERMINATION SCHEME FOR HIGH-SPEED PULSE-PROPAGATION ON A SYSTEM OF TIGHTLY COUPLED COPLANAR STRIPS
(1994-06-01)
KUO, JT
;
TZUANG, CKC
;
傳播研究所
;
電信工程研究所
;
Institute of Communication Studies
A realistic termination scheme is proposed for closely coupled N-conductor microstrips. The design aims to achieve satisfactorily low signal reflection and good fabrication feasibility for the planar MMIC (Monolithic Microwave Integrated Circuit) process. The matched termination network (MTN) for a lossless three-line coupled microstrip structure is presented. High-speed pulse transmission along terminated tightly coupled microstrip lines is analyzed using modal analysis in the frequency domain. Theoretical results for the propagating and reflected waveforms are obtained by applying the inverse discrete Fourier transform (IDFT) to the system responses. These responses are obtained by applying the theory of multiconductor transmission lines to a dispersive database which has been computed using the spectral-domain approach (SDA). The response of a six-line closely coupled microstrip circuit terminated by the proposed termination scheme is measured using the HP8510D network analyzer. The measured results show that the reflected signal is below -30 dB and the results are in good agreement with the theoretical waveforms.
ACCURATE QUASI-TEM SPECTRAL-DOMAIN ANALYSIS OF SINGLE AND MULTIPLE COUPLED MICROSTRIP LINES OF ARBITRARY METALLIZATION THICKNESS
(1995-08-01)
KUO, JT
;
交大名義發表
;
電信工程研究所
;
National Chiao Tung University
;
Institute of Communications Engineering
The quasi-TEM spectral domain approach (SDA) is extended to rigorously and efficiently analyze single and multiple coupled microstrip lines of arbitrary metallization thickness, The charge distributions on both the horizontal and vertical conductor surfaces are modeled by global basis functions, This results in a relatively small matrix for accurate determination of the line parameters of coupled thick microstrips. A convergence study is performed for the results of a pair of coupled lines with crucial structural parameters to explore the conditions for obtaining reliable solutions using the technique. Results for thick microstrips are validated through comparison with those from available measurements and another theoretical technique. The soundness of the technique is further demonstrated by looking into the trend of the results obtained by a simplified model in which the structural parameters are pushed, step by step, to the numerical extremities. Variations of circuit parameters of a four-line coupled microstrip structure due to the change of finite metallization thickness are presented and discussed.
COMPLEX-MODES IN SHIELDED SUSPENDED COUPLED MICROSTRIP LINES
(1990-09-01)
KUO, JT
;
TZUANG, CKC
;
電信工程研究所
;
電子與資訊研究中心
;
Institute of Communications Engineering
MODAL CURRENT DISTRIBUTIONS ON CLOSELY COUPLED MICROSTRIP LINES - A COMPARATIVE-STUDY OF THE SDA BASIS FUNCTIONS
(1990-03-29)
TZUANG, CKC
;
KUO, JT
;
交大名義發表
;
傳播研究所
;
National Chiao Tung University