Browsing by Author "Kuo, C. I."

Now showing 1 - 5 of 5

Effect of graded-temperature arsenic prelayer on quality of GaAs on Ge/Si substrates by metalorganic vapor phase epitaxy
(2011-10-24)
Yu, H. W.
;
Chang, E. Y.
;
Yamamoto, Y.
;
Tillack, B.
;
Wang, W. C.
The growth of GaAs epitaxy on Ge/Si substrates with an arsenic prelayer grown with graded temperature ramped from 300 to 420 degrees C is investigated. It is demonstrated that the graded-temperature arsenic prelayer grown on a Ge/Si substrate annealed at 650 degrees C not only improves the surface morphology (roughness: 1.1 nm) but also reduces the anti-phase domains' (APDs) density in GaAs epitaxy (dislocation density: similar to 2 x 10(7) cm(-2)). Moreover, the unwanted interdiffusion between Ge and GaAs epitaxy is suppressed by using the graded-temperature arsenic prelayer due to the low energy of the Ge-As bond and the use of a low V/III ratio of 20. (C) 2011 American Institute of Physics. [doi:10.1063/1.3656737]
Effect of substrate misorientation on the material properties of GaAs/Al(0.3)Ga(0.7)As tunnel diodes
(2010-12-06)
Yu, H. W.
;
Chang, E. Y.
;
Nguyen, H. Q.
;
Chang, J. T.
;
Chung, C. C.
The effect of substrate misorientation on the material quality of the N(++)-GaAs/P(++)-AlGaAs tunnel diodes (TDs) grown on these substrates is investigated. It is found that the misorientation influences both surface roughness and interface properties of the N(++)-GaAs/P(++)-AlGaAs TDs. Smooth surface (rms roughness: 1.54 angstrom) and sharp interface for the GaAs/Al(0.3)Ga(0.7)As TDs were obtained when the (100) tilted 10 degrees off toward [111] GaAs substrate was used. Besides, the oxygen content in N(++)-GaAs and P(++)-AlGaAs layers grown on the 10 degrees off GaAs substrates was reduced due to the reduction of sticking coefficient and number of anisotropic sites. (C) 2010 American Institute of Physics. [doi:10.1063/1.3525158]
Effect of substrate misorientation on the material properties of GaAs/Al0.3Ga0.7As tunnel diodes
(2010-12-06)
Yu, H. W.
;
Chang, E. Y.
;
Nguyen, H. Q.
;
Chang, J. T.
;
Chung, C. C.
The effect of substrate misorientation on the material quality of the N++-GaAs/P++-AlGaAs tunnel diodes (TDs) grown on these substrates is investigated. It is found that the misorientation influences both surface roughness and interface properties of the N++-GaAs/P++-AlGaAs TDs. Smooth surface (rms roughness: 1.54 angstrom) and sharp interface for the GaAs/Al0.3Ga0.7As TDs were obtained when the (100) tilted 10 degrees off toward [111] GaAs substrate was used. Besides, the oxygen content in N++-GaAs and P++-AlGaAs layers grown on the 10 degrees off GaAs substrates was reduced due to the reduction of sticking coefficient and number of anisotropic sites. (C) 2010 American Institute of Physics. [doi:10.1063/1.3525158]
Electrical Characterization of Al(2)O(3)/n-InAs Metal-Oxide-Semiconductor Capacitors With Various Surface Treatments
(2011-06-01)
Trinh, H. D.
;
Brammertz, G.
;
Chang, E. Y.
;
Kuo, C. I.
;
Lu, C. Y.
Ex situ sulfide and HCl wet chemical treatments in conjunction with in situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al(2)O(3) on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. The capacitance-voltage C-V characterization of Al(2)O(3)/n-InAs structures shows that the frequency dispersion in the accumulation regime is small (< 0.75%/dec) and does not seem to be significantly affected by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the n-channel metal-oxide-semiconductor capacitors. The interface trap density profiles extracted from the simulation mainly show donorlike interface states inside the InAs band gap and in the lower part of the conduction band. The donorlike traps inside the InAs band gap and in the lower part of the conduction band were significantly reduced by using wet-chemical-plus-TMA treatments, in agreement with C-V characteristics.
Electrical Characterization of Al2O3/n-InAs Metal-Oxide-Semiconductor Capacitors With Various Surface Treatments
(2011-06-01)
Trinh, H. D.
;
Brammertz, G.
;
Chang, E. Y.
;
Kuo, C. I.
;
Lu, C. Y.
Ex situ sulfide and HCl wet chemical treatments in conjunction with in situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al2O3 on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. The capacitance-voltage C-V characterization of Al2O3/n-InAs structures shows that the frequency dispersion in the accumulation regime is small (< 0.75%/dec) and does not seem to be significantly affected by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the n-channel metal-oxide-semiconductor capacitors. The interface trap density profiles extracted from the simulation mainly show donorlike interface states inside the InAs band gap and in the lower part of the conduction band. The donorlike traps inside the InAs band gap and in the lower part of the conduction band were significantly reduced by using wet-chemical-plus-TMA treatments, in agreement with C-V characteristics.