Browsing by Author "Kuo, Tsung-Hsien"
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Item type:Item, Efficient organic optoelectronics with multilayer structures(2012) ;Kuo, Tsung-Hsien ;Chen, Fang-Chung ;Li, Juo-Hao ;Huang, Annie TzuyuHuang, Jen-HsienIn this study we developed efficient polymer solar cells (PSCs) and polymer light emitting diodes (PLEDs) incorporating multilayer structures prepared through solution processing. To prevent dissolution of the bottom layer by the subsequent layer, we used a polydimethylsiloxane stamp to transfer the film onto the target surface. The active layer of the PSCs consisted of a poly(3-hexylthiophene) (P3HT)-rich layer and a [6,6]-phenyl-C(61)-butyric acid methyl ester (PCBM)-rich layer; the active layer of the PLEDs consisted of a blue-polyfluorene as the light emitting layer (LEL) and poly (9,9-di-n-octylfluorene-alt-(1,4-phenylene-((4-sec-butylphenyl)imino-1,4-phenylene))) (TFB) as the electron blocking layer (EBL). We found that the efficiency of devices was readily manipulated by changing the constitution of each stacking layer. After optimizing the fabrication conditions for each functional layer, we obtained PSCs reaching a power conversion efficiency of 3.52%. The efficiency of PLEDs incorporating an EBL was 27% greater (reaching 4.7 cdA(-1)) than that prepared without an EBL layer.Item type:Item, Fabrication of multilayer organic solar cells through a stamping technique(2009) ;Huang, Jen-Hsien ;Ho, Zhong-Yo ;Kuo, Tsung-Hsien ;Kekuda, DhananjayChu, Chih-WeiIn this article, we demonstrate a simple and reliable stamping technique for fabricating multi-layer solar cells. A poly(di-methylsilane) (PDMS) stamp is used for transferring the active layers onto the substrate. An intermediate solvent treatment is introduced to temporarily modify the PDMS surface; therefore, the polymer film can be uniformly formed on top of the PDMS surface. This method is involves non-contaminative and non-invasive processes, therefore it can avoid possible degradation or contamination of the polymer film and the PDMS stamp can be reused. Devices realized through this stamping technique both by direct and inverted structures exhibited power conversion efficiencies of 3.2 and 2.83% respectively.