Browsing by Author "LIN, MS"
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Item type:Item, A NEW APPROACH TO MODELING THE SUBSTRATE CURRENT OF PRESTRESSED AND POST-STRESSED MOSFETS(1995-06-01) ;YANG, JJ ;SHAOSHIUN, S ;CHOU, PC ;CHEN, CHLIN, MSIn this paper, we propose a closed form expression of a new and accurate analytical substrate current model for both pre-stressed and post-stressed MOSFET's, It was derived based on the concept of effective electric field, which gives a more reasonable impact ionization rate in the lucky-electron model, This effective electric field, composed by two experimentally determined parameters, ran be regarded as a result of nonlocal heating effects within de,ices, This model shows a significant improvement to the conventional local field model. One salient feature of the present model is that it allows us to characterize the time evolution of the substrate current of stressed MOSFET's for the first time. Experimental verification for a wide variety of MOSFET's with effective channel lengths down to 0.3 mu m shows that the new model is very accurate and is feasible for any kind of MOS device with different drain structures, The present model can be applied to explore the hot carrier effect in designing submicrometer MOS devices with emphasis on the design optimization of a device drain engineering issue, In addition, the present model is well suited for device reliability analysis and circuit level simulations.Item type:Item, AN EFFICIENT PRECLEAN OF ALUMINIZED SILICON SUBSTRATE FOR CHEMICAL-VAPOR-DEPOSITION OF SUBMICRON TUNGSTEN PLUGS(1995-10-01) ;YEH, WK ;TSAI, MH ;CHEN, SH ;CHEN, MCWANG, PJPreclean of aluminum trench and via patterned substrates is vital for successful selective chemical vapor deposition of tungsten (CVD-W). A convenient preclean method uses in situ. BCl3 plasma etching to remove the native metal oxide prior to conducting the CVD-W. During the plasma etching, however, the outsputtered aluminum oxide and aluminum can be redeposited on the sidewall of the trench and via hole and on the surface of the dielectric layer, where W nucleation is induced, resulting in creep-up and selectivity loss during tungsten deposition. By using a solution of hydroxylamine sulfate to pretreat the aluminum trench and via hole patterned substrates, we successfully avoid the creep-up and selectivity loss of W deposition.Item type:Item, AN EFFICIENT PRECLEAN OF ALUMINIZED SILICON SUBSTRATE FOR CHEMICAL-VAPOR-DEPOSITION OF SUBMICRON TUNGSTEN PLUGS(1995-10-01) ;YEH, WK ;TSAI, MH ;CHEN, SH ;CHEN, MCWANG, PJPreclean of aluminum trench and via patterned substrates is vital for successful selective chemical vapor deposition of tungsten (CVD-W). A convenient preclean method uses in situ. BCl3 plasma etching to remove the native metal oxide prior to conducting the CVD-W. During the plasma etching, however, the outsputtered aluminum oxide and aluminum can be redeposited on the sidewall of the trench and via hole and on the surface of the dielectric layer, where W nucleation is induced, resulting in creep-up and selectivity loss during tungsten deposition. By using a solution of hydroxylamine sulfate to pretreat the aluminum trench and via hole patterned substrates, we successfully avoid the creep-up and selectivity loss of W deposition.Item type:Item, CHARACTERIZATION OF A HIGH-QUALITY AND UV-TRANSPARENT PECVD SILICON-NITRIDE FILM FOR NONVOLATILE MEMORY APPLICATIONS(1994) ;WANG, CK ;YING, TL ;WEI, CS ;LIU, LMCHENG, HCItem type:Item, CHEMORHEOLOGY ON SIMULTANEOUS IPN FORMATION OF EPOXY-RESIN AND UNSATURATED POLYESTER(1992-10-15) ;LIN, MS ;CHANG, RJ ;交大名義發表 ;應用化學系National Chiao Tung UniversityStudy of the simultaneous interpenetrating polymer network (IPN) between diglycidyl ether of bisphenol-A (DGEBA) and unsaturated polyester (UP) was carried out at ambient temperature. Fourier transform infrared (FTIR) spectroscopy was employed to investigate the intermolecular H-bonding and functional group changes. Viscosity changes due to H-bonding and crosslinking were examined with a Brookfield viscometer. Gelation time was measured by a Techne gelation timer. Complexation between Co (II) (the promoter for UP cure) and diamine (the curing agent for DGEBA) was detected with UV-visible spectrometer. Experimental evidence revealed that intermolecular interactions were observed in systems such as DGEBA/UP, DGEBA/diamine, UP/diamine, Co (II) /diamine, DGEBA/uncured UP, and UP/uncured DGEBA. All such interactions had measurable effects on the curing behaviors for both networks, as were indicated by the viscosity changes and gelation time. The IPNs thus obtained were further characterized with rheometric dynamic spectroscopy (RDS) and differential scaning calorimetry (DSC). Partial compatibility between UP and DGEBA networks was evidenced from a main damping peak with a shoulder near glass transition temperature (T(g)) for lower UP content; while at higher UP content, only a main damping peak near T(g) was observed. DSC revealed a broad glass transition for all IPNs. The resultant IPN materials were all transparent.Item type:Item, COMPATIBLE SIMULTANEOUS INTERPENETRATING POLYMER NETWORKS BASED ON EPOXY-RESIN AND POLY(POLY(ETHYLENE GLYCOL)MALEATE)(1993) ;LIN, MS ;JENG, KT ;YANG, T ;交大名義發表應用化學系Poly(poly(ethylene glycol)maleate) (PPEGMA) was synthesized from poly(ethylene glycol) of molecular weight 200 with maleic anhydride in a molar ratio of 1:1. PPEGMA was then blended with diglycidyl ether of bisphenol A (DGEBA) in various ratios. The formation of hydrogen bonds between PPEGMA and DGEBA was investigated with FTi.r. These blends were then cured with benzoyl peroxide and m-xylenediamine simultaneously to obtain simultaneous interpenetrating polymer networks (SINs). Cure behaviours via exothermic peaks were recorded by dynamic d.s.c. The SINs thus obtained were characterized with rheometric dynamic spectroscopy (r.d.s.) and d.s.c. to check the compatibility of the two constituent networks. Gel fractions were measured with a Soxhlet extractor using acetone as solvent. Hydrogen bonding in the PPEGMA/DGEBA blend was evidenced from the v(C=O) shift to lower wavenumber. During SIN formation, dynamic d.s.c. showed a shift of the exothermic peak to a higher and broader temperature range, indicating a network interlocking effect which was overcome by higher temperature. Full compatibility of PPEGMA/DGEBA SINs was found for all compositions. The compatibility between PPEGMA and DGEBA was supported from the inner shifts of a single damping peak in r.d.s. and a single glass transition in d.s.c. for each of the SINs.Item type:Item, CURING BEHAVIOR OF FULLY AND SEMIINTERPENETRATING POLYMER NETWORKS BASED ON EPOXY AND ACRYLICS(1995-11-01) ;LIN, MS ;LEE, ST ;交大名義發表 ;應用化學系National Chiao Tung UniversityFully interpenetrating polymer networks (IPNs) based on diglycidyl ether of bisphenol A (DGEBA) and ethylene dimethacrylate (EDMA) were prepared by using isophoronediamine and benzoyl peroxide as curing agents. Semi-IPNs based on DGEBA and 2-hydroxyethyl methacrylate (HEMA) were also prepared using the same curing agents. Intermolecular interactions were investigated by Fourier transform infra-red spectroscopy. Curing behaviours were studied by dynamic differential scanning calorimetry (d.s.c.) and a Brookfield viscometer. Experimental results revealed that H-bonding in DGEBA/EDMA and DGEBA/HEMA occurred, in shifting of carbonyl and epoxide absorptions to lower wavenumber. Results also revealed that during curing reactions the dynamic d.s.c. thermograms for the fully IPNs showed a shift of the exothermic peaks to a higher and broader temperature range, while in HEMA/DGEBA semi-IPNs, the exothermic peaks shifted to a lower temperature range. On the other hand, a retarded viscosity increase was observed for fully IPNs, and an accelerated viscosity increase was found for semi-IPNs. An effect of network interlock was proposed to interpret this retarded curing behaviour of fully IPNs, while a catalytic effect of the OH group was found to explain the accelerated curing behaviour of semi-IPNs. These findings were reasonably consistent with the lower gel fractions and lower glass transitions found for fully IPNs. The calculated average molecular weight of chain length ((M) over bar(c)) between crosslinkages also conforms to the experimental results.Item type:Item, DIRECT EVIDENCE OF GATE OXIDE THICKNESS INCREASE IN TUNGSTEN POLYCIDE PROCESSES(1991-11-01) ;HSU, SL ;LIU, LM ;LIN, MS ;CHANG, CY電子工程學系及電子研究所The increase of the "effective" gate oxide thickness for W-polycide processes is studied. The samples with as-deposited and annealed W polycide are analyzed by secondary ion mass spectrometry, transmission electron microscopy (TEM), and high-frequency CV measurements. The TEM cross section shows that the gate oxide thicknesses are approximately 244 and approximately 285 angstrom for as-deposited and 1000-degrees-C annealed samples, respectively. The TEM results agree with that from CV measurements. The TEM analyses provide a direct physical evidence of an additional oxide thickness (approximately 41 angstrom) during the W-polycide annealing.Item type:Item, DISTRIBUTED PROGRAM RELIABILITY-ANALYSIS(1992) ;LIN, MS ;CHEN, DJ ;交大名義發表 ;資訊科學與工程研究所National Chiao Tung UniversityThis paper presents an algorithm for computing the distributed program reliability in Distributed Computing Systems (DCS). The algorithm, called FREA (Fast Reliability Evaluation Algorithm). is based on the generalized factoring theorem with several incorporated reliability-preserving reductions to speedup the reliability evaluation. The effect of file distributions, program distributions, and various topologies on reliability of the DCS is studied in detail using the proposed algorithm. To compute the Distributed Program Reliability, the ARPA network is studied to illustrate the feasibility of the proposed algorithm.Item type:Item, DISTRIBUTED PROGRAM RELIABILITY-ANALYSIS(1992-01-01) ;LIN, MS ;CHEN, DJ ;資訊科學與工程研究所Institute of Computer Science and EngineeringThis paper presents an algorithm for computing the distributed program reliability in Distributed Computing Systems (DCS). The algorithm, called FREA (Fast Reliability Evaluation Algorithm). is based on the generalized factoring theorem with several incorporated reliability-preserving reductions to speedup the reliability evaluation. The effect of file distributions, program distributions, and various topologies on reliability of the DCS is studied in detail using the proposed algorithm. To compute the Distributed Program Reliability, the ARPA network is studied to illustrate the feasibility of the proposed algorithm.Item type:Item, FIELD INVERSION GENERATED IN THE CMOS DOUBLE-METAL PROCESS DUE TO PETEOS AND SOG INTERACTIONS(1993-01-01) ;HSU, SL ;LIU, LM ;FANG, CH ;YING, SLCHEN, TLSevere field inversion has been observed in the circuits fabricated by the CMOS double metal process using PETEOS/inorganic SOG/PEOX as the inter-metal dielectrics and PEOX/PECVD nitride as the passivation layer. We have performed detailed studies to conclude that the field inversion is caused by the interaction between PETEOS and non-carbon-based SOG, triggered by the H+ released from PECVD nitride during the sintering. No field inversion is observed when PEOX/inorganic SOG/PEOX is used as the inter-metal dielectrics. The effect of field inversion on the circuit yield is also discussed.Item type:Item, FULLY AND SEMIINTERPENETRATING POLYMER NETWORKS BASED ON EPOXY AND ACRYLICS(1994-01-01) ;LIN, MS ;LEE, ST ;應用化學系Department of Applied ChemistryItem type:Item, GENERAL REDUCTION METHODS FOR THE RELIABILITY-ANALYSIS OF DISTRIBUTED COMPUTING SYSTEMS(1993) ;LIN, MS ;CHEN, DJ ;交大名義發表 ;資訊科學與工程研究所National Chiao Tung UniversityThe reliability of a distributed computing system is the probability that a distributed program which runs on multiple processing elements and needs to communicate with other processing elements for remote data files will be executed successfully. This reliability varies according to (1) the topology of the distributed computing system, (2) the reliability of the communication links, (3) the data files and program distribution among processing elements, and (4) the data files required to execute a program. This, the problem of analyzing the reliability of a distributed computing system is more complicated than the K-terminal reliability problem, and many of the reliability-preserving reductions for speeding up the computation of the K-terminal reliability cannot be applied to this problem. In this paper, we shall propose several reduction methods for computing the reliability of distributed computing systems. These reduction methods can dramatically reduce the size of a distributed computing system, and therefore speed up the reliability computation.Item type:Item, HALF-BAND FILTER DESIGN WITH ODD-POLYNOMIAL CHEBYSHEV-APPROXIMATION(1991-08-01) ;CHANG, WT ;LIN, MS ;電信工程研究所 ;電信研究中心Institute of Communications EngineeringAn efficient method for the design of the half-band filter is described. Both the characteristics of the time response and the frequency response of the half-band filter are fully utilised to reduce the computation time and to increase the computation accuracy. The algorithm is based on the Chebyshev approximation criterion and uses only odd-symmetry polynomials for frequency interpolation to meet the required frequency response of the half-band filter.Item type:Item, KINETIC-STUDIES OF COMPATIBLE SIMULTANEOUS INTERPENETRATING POLYMER NETWORKS BASED ON POLY(POLY(ETHYLENE GLYCOL) MALEATE) AND EPOXY-RESIN(1994) ;LIN, MS ;YANG, T ;HUANG, KY ;交大名義發表應用化學系A simultaneous interpenetrating polymer network (SIN) based on diglycidyl ether of bisphenol A (DGEBA) and poly(poly(ethylene glycol) maleate) (PPEGMA) in a 50/50 weight ratio was blended and was cured simultaneously by using benzoyl peroxide and m-xylenediamine as curing agents. Kinetic studies during SIN formation were carried out at 50, 60, 65 and 70-degree-C. Concentration changes of both epoxide and double bonds were monitored with Fourier-transform infra-red spectroscopy. Rate expressions were established with model reactions. Experimental results revealed that lower rate constants and higher activation energies for SIN were found compared with those for the formation of the respective component networks. A network interlock effect was proposed to account for this phenomenon. During simultaneous cure of DGEBA and PPEGMA, network interlock must provide a sterically hindered environment, which subsequently increased activation energies and reduced cure rates for both DGEBA and PPEGMA.Item type:Item, KINETIC-STUDY ON SIMULTANEOUS INTERPENETRATING POLYMER NETWORK FORMATION OF EPOXY-RESIN AND UNSATURATED POLYESTER(1995-03-21) ;LIN, MS ;CHANG, RJ ;YANG, T ;SHIH, YF應用化學系Simultaneous interpenetrating polymer networks (SIN) based on diglycidyl ether of bisphenol-A (DGEBA) and unsaturated polyester (UP) in weight ratios of 100/0, 50/50, and 0/100 were blended and cured simultaneously by using cumene hydroperoxide (CHP) and m-xylenediamine (MXDA) as curing agents. A kinetic study during SIN formation was carried out at 43, 53, 58, and 64 degrees C. Concentration changes for both epoxide and C=C bond were monitored with Fourier transform infrared (FTIR). Rate expressions for epoxide polymerization were established with model reactions for phenyl glycidyl ether (PGE) and benzylamine in dichloroethane containing benzyl alcohol. Experimental results revealed that a lower cure rate constant for the C=C bond during SIN formation was found, compared with pure UP network formation. A model of network interlock is proposed to account for this phenomenon. During simultaneous cure of DGEBA and UP, the network interlock should provide a sterically hindered environment, which subsequently retards cure rate for UP. On the other hand, epoxide cure during SIN formation indicates higher rate constants for both uncatalyzed and catalyzed reactions, compared with those of pure DGEBA cure. Presumably the catalytic effect of hydroxyl end groups in UP overcomes the effect of network interlock. Kinetic parameters were calculated and are discussed. (C) 1995 John Wiley and Sons, Inc.Item type:Item, ON DISTRIBUTED COMPUTING SYSTEMS RELIABILITY-ANALYSIS UNDER PROGRAM EXECUTION CONSTRAINTS(1994-01-01) ;CHEN, DJ ;LIN, MS ;交大名義發表 ;資訊科學與工程研究所National Chiao Tung UniversityThis correspondence presents an algorithm for computing the reliability of distributed computing systems (DCS). The algorithm, called the Fast Reliability Evaluation Algorithm, is based on the factoring theorem employing several reliability preserving reduction techniques. The effect of file distributions, program distributions, and various topologies on reliability of the DCS is studied in detail using the proposed algorithm. Compared with existing algorithms on various network topologies, file distributions, and program distributions, the proposed algorithm is much more economical in both time and space. To compute the distributed program reliability, the ARPA network is studied to illustrate the feasibility of the proposed algorithm.Item type:Item, OPTICALLY CLEAR SIMULTANEOUS INTERPENETRATING POLYMER NETWORKS BASED ON POLY(ETHYLENE GLYCOL) DIACRYLATE AND EPOXY .1. PREPARATION AND CHARACTERIZATION(1992-08-01) ;LIN, MS ;JENG, KT ;交大名義發表 ;應用化學系National Chiao Tung UniversityPoly(ethylene glycol) diacrylate was synthesized from poly(ethylene glycol) of molecular weight 600 with acryloyl chloride in a molar ratio of 1 : 2. Poly (ethylene glycol) diacrylate (PEGDA) was then blended with diglycidyl ether of bisphenol A (DGEBA) in various ratios, followed by curing with 2,2'-azobisisobutyronitrile (AIBN) and isophronediamine (IPDA) simultaneously. Viscosity changes before and during IPN formation were examined with a Brookfield viscometer. Formation of H-bonding and functional group changes were investigated with FTIR. Exothermic curing thermograms were recorded with dynamic DSC. Optically clear IPNs thus obtained were characterized with rheometric dynamic spectroscopy (RDS) and scanning electron microscopy (SEM) to check possible compatibility of the two networks. Experimental results revealed that during IPN formation hydrogen bonds between PEGDA and DGEBA and interlock of networks had profound effect on viscosity change and pot-life. Complete compatibility of the IPNs was found as DGEBA content was higher than 50% by weight. The compatibility between PEGDA and DGEBA networks was evidenced from inner shift of a single damping peak in RDS. In the meantime, SEM micrographs confirmed the coincidence with the result of RDSItem type:Item, OPTICALLY CLEAR SIMULTANEOUS INTERPENETRATING POLYMER NETWORKS BASED ON POLY(ETHYLENE GLYCOL)DIACRYLATE AND EPOXY .2. KINETIC-STUDY(1993-12-01) ;LIN, MS ;JENG, KT ;HUANG, KY ;SHIH, YF交大名義發表Simultaneous interpenetrating polymer networks (SINs) based on diglycidyl ether of bisphenol A (DGEBA) and poly(ethylene glycol) diacrylate (PEGDA) in weight ratios of 100/0, 50/50, and 0/ 100 were blended and cured simultaneously by using benzoyl peroxide (BPO) and m-xylenediamine (MXDA) as curing agents. A kinetic study during SIN formation was carried out at 45, 55, 63, and 70-degrees-C. Concentration changes for both the epoxide and C = C bond were monitored with FTIR. A rate expression for DGEBA cure kinetics was established with a model reaction of phenyl glycidyl ether (PGE) and benzylamine. Experimental results revealed that lower rate constants and higher activation energy for the SIN were found, compared with those for the constituent DGEBA and PEGDA network formation. A model of network interlock was proposed to account for this phenomenon. During simultaneous cure of DGEBA and PEGDA, the interlock (mutual entanglement) between DGEBA and PEGDA networks provided a sterically hindered environment, which subsequently increased the activation energy and reduced cure rates for both DGEBA and PEGDA. (C) 1993 John Wiley & Sons, Inc.Item type:Item, PREPARATION AND CHARACTERIZATION OF WATER-SOLUBLE AND CROSS-LINKABLE CELLULOSE ACRYLATE(1993) ;LIN, MS ;CHEN, AJ ;交大名義發表 ;應用化學系National Chiao Tung UniversityThe reaction of cellulose with acryloyl chloride in LiCl/N,N-dimethyl acetamide resulted in a water soluble cellulose acrylate. The degree of substitution per anhydroglucose unit was determined from the titration of the double bond with bromine. Crosslinking of the acryloyl moieties was carried out in aqueous solution using K2S2O8/FeSO4 as redox initiator. The original cellulose, cellulose acrylate and the crosslinked cellulose acrylate were characterized by i.r., wide-angle X-ray diffraction, d.s.c., t.g.a. and solid state C-13 n.m.r. Crosslinked cellulose is insoluble in water and the gel fraction was measured with a Soxhlet extractor. The fundamental properties of the crosslinked cellulose acrylate films were evaluated. Experimental results indicated that this water soluble and crosslinkable cellulose acrylate is a promising candidate as a water-borne coating material.