Browsing by Author "Lai Ming-Fang"

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ESD PROTECTION STRUCTURE FOR 3D IC
(2012-06-21)
Chen Kuan-Neng
;
Lai Ming-Fang
;
Chen Hung-Ming
An electrostatic discharge (ESD) protection structure for a 3D IC is provided. The ESD protection structure includes a first active layer, a through-silicon via (TSV) device and a second active layer. The TSV is disposed in the first active layer, and the second active layer is stacked with the first active layer. The second active layer includes a substrate and an ESD protection device, wherein the ESD protection device having a doping area embedded in the substrate, and the ESD protection device electrically connects the TSV device.
Integrated circuit device
(2014-02-18)
Chen Kuan-Neng
;
Lai Ming-Fang
;
Chen Hung-Ming
An integrated circuit device includes: a first chip including a first substrate and a main circuit formed on said first chip; a second chip stacked on the first substrate and including a second substrate that is independent from the first substrate, and a protective circuit for protecting the main circuit; and a conductive channel unit extending from the protective circuit and electrically connected to the main circuit.
Integrated Circuit Device
(2013-07-04)
Chen Kuan-Neng
;
Lai Ming-Fang
;
Chen Hung-Ming
An integrated circuit device includes: a first chip including a first substrate and a main circuit formed on said first chip; a second chip stacked on the first substrate and including a second substrate that is independent from the first substrate, and a protective circuit for protecting the main circuit; and a conductive channel unit extending from the protective circuit and electrically connected to the main circuit.