Browsing by Author "Lee, C. T."

Now showing 1 - 4 of 4

An Al(2)O(3) AlGaAs/InGaAs Metal-Oxide-Semiconductor PHEMT SPDT Switch with Low Control Currents for Wireless Communication Applications
(2010-01-01)
Wu, Yun-Chi
;
Lin, Yueh-Chin
;
Chang, Edward Yi
;
Lee, C. T.
;
Kei, Chi-Chung
An AlGaAs/InGaAs metal-oxide-semiconductor pseudomorphic high electron mobility transistor (MOS-PHEMT) single- pole-double-throw (SPDT) switch using Al(2)O(3) high-k gate dielectric by atomic layer deposition is fabricated. The MOS-PHEMT exhibited a comparable dc performance and a much lower gate current compared to PHEMT. Radio-frequency (rf) test shows that the MOS-PHEMT switch has an insertion loss of less than 0.5 dB, an isolation larger than 30 dB, a return loss larger than 15 dB, and an input power for 1 dB compression of 31.4 dBm at 2.5 GHz. Overall, MOS-PHEMT monolithic microwave integrated circuits switches have comparable rf performance to PHEMT switches but with much lower dc power consumption. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3380967] All rights reserved.
An Al2O3 AlGaAs/InGaAs Metal-Oxide-Semiconductor PHEMT SPDT Switch with Low Control Currents for Wireless Communication Applications
(2010-01-01)
Wu, Yun-Chi
;
Lin, Yueh-Chin
;
Chang, Edward Yi
;
Lee, C. T.
;
Kei, Chi-Chung
An AlGaAs/InGaAs metal-oxide-semiconductor pseudomorphic high electron mobility transistor (MOS-PHEMT) single- pole-double-throw (SPDT) switch using Al2O3 high-k gate dielectric by atomic layer deposition is fabricated. The MOS-PHEMT exhibited a comparable dc performance and a much lower gate current compared to PHEMT. Radio-frequency (rf) test shows that the MOS-PHEMT switch has an insertion loss of less than 0.5 dB, an isolation larger than 30 dB, a return loss larger than 15 dB, and an input power for 1 dB compression of 31.4 dBm at 2.5 GHz. Overall, MOS-PHEMT monolithic microwave integrated circuits switches have comparable rf performance to PHEMT switches but with much lower dc power consumption. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3380967] All rights reserved.
In0.5Ga0.5As-Based Metal-Oxide-Semiconductor Capacitor on GaAs Substrate Using Metal-Organic Chemical Vapor Deposition
(2013-01-01)
Nguyen, H. Q.
;
Trinh, H. D.
;
Chang, E. Y.
;
Lee, C. T.
;
Wang, Shin Yuan
We demonstrate the good-performance In0.5Ga0.5As-based metal-oxide-semiconductor capacitor (MOSCAP) on GaAs substrate using metal-organic chemical vapor deposition technique. In0.5Ga0.5As film grown on GaAs substrate is proved to be high quality with threading dislocation density as low as 10(6) cm(-2). The performance of the MOSCAPs is comparable to that of In0.53Ga0.47As/InP-based devices grown by molecular beam epitaxy technique. The devices show a nice capacitance-voltage response, with small frequency dispersion. The parallel conductance contours show the free movement of Fermi level with the gate bias. Acceptable interface trap density D-it values of 5 x 10(11)-2 x 10(12) eV(-1) . cm(-2) in the energy range of 0.64-0.52 eV above the InGaAs valence band maximum in In0.5Ga0.5As/GaAs MOSCAPs obtained by conductance methods were shown.
Interfacial reactions of Pt-based Schottky contacts on nGaP
(2008-02-25)
Chu, L. H.
;
Chang, E. Y.
;
Wu, Y. H.
;
Huang, J. C.
;
Chen, Q. Y.
We have investigated the interfacial reaction between platinum and InGaP in a Schottky diode structure. There was a 7.5-nm-thick amorphous layer formed at the interface between Pt and InGaP after metal deposition. After annealing at 325 degrees C for 1 min, this amorphous layer increased to 12.8 nm and the reverse leakage current also decreased. The diffusion of Pt atoms and the crystallization of amorphous layer took place after annealing at 325 degrees C for 10 min. Prolonging the annealing to 3 h led to formation of Ga(2)Pt and GaPt(3) phases in InGaP and Schottky diodes degraded after these new phases were observed. (C) 2008 American Institute of Physics.