Browsing by Author "Lee, YW"

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A low temperature wafer-level hermetic MEMS package using UV curable adhesive
(2004)
Liang, ZH
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Cheng, YT
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Hsu, W
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Lee, YW
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電子工程學系及電子研究所
In order to lower the packaging cost and resolve the process complexity of MEMS fabrications, a new wafer-level post-process hermetic package using UV curable adhesive bonding is introduced for MEMS applications. The UV curable adhesive is cured through UV light exposure without any additional heating, suitable for packaging the devices with temperature sensitive materials or processes. A Pyrex 7740 glass is micromachined and used as a protection cap substrate with microcavities which is spin-coated with the adhesive, aligned, and bonded with a device substrate to form the package after the UV curing. Finally, electrical contact pads expose and die separation are done simultaneously by dicing. Two different monitoring devices, dew point sensor and capacitive accelerometer are built to evaluate the package strength and hermeticity. After dicing operation, no structure damage or stiction phenomenon is found in the packaged capacitive accelerometer. Furthermore, no moisture condensation is observed in the package with 190mum bonding width after 150 minutes boil water immersion. The acceleration test results indicate the package can survive more than 3 weeks at 25degreesC, 100% R.H. (Relative Humidity) working environment.
An efficient file transmission algorithm for distributed computing systems
(1996)
Chen, DJ
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Chang, PY
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Lee, YW
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交大名義發表
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資訊工程學系
In a distributed system, executing a program often requires the access of remote data files. An efficient data transmission strategy is thus important for real-time applications. Since data files may be replicated and their locations are transparent to the executed program, it becomes system's responsibility to select a proper file server such that data can be transmitted in an effective way. In this paper, we consider the scenario that a particular program needs several data files simultaneously for its execution. Each datafile may has replicas across the network. The problem is how to find a collection of file servers and the routing paths such that the data transmission time is minimum. An exhaustive approach could of course find the optimal solution. However if pays for high computation price. We thus proposes a heuristic method. Results obtained from the proposed method are encouraging.
Fermi and anti-Fermi glass transition and subband resonant quantum tunneling in Nb/Ti metallic multilayer films
(2000-04-01)
Lue, JT
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Liang, SY
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Lee, YW
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Lue, HT
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電子工程學系及電子研究所
Multilayer of Nb/Ti and NbN/Ti films with 30 periodic structure were sputtered onto silicon substrates. The current-voltage characteristics measured along the vertical junction at low temperatures exhibit nonlinear step-wise curves. The resonant subband quantum tunneling in the metallic multiple quantum wells can satisfactorily express these peculiar behaviors. The Fermi and anti-Fermi glass transition showing itinerant metallic and insulating conduction properties are also observed at low currents and near critical temperatures.