Browsing by Author "Lee, Yung-Yu"
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Item type:Item, A 188-size 2.1mm(2) Reconfigurable Turbo Decoder Chip with Parallel Architecture for 3GPP LTE System(2009) ;Wong, Cheng-Chi ;Lee, Yung-Yu ;Chang, Hsie-Chia ;電子工程學系及電子研究所Department of Electronics Engineering and Institute of ElectronicsThis paper presents a turbo decoder chip supporting all 188 block sizes in 3GPP LTE standard. The design allows 1, 2, 4, or 8 SISO decoders to concurrently process each block size, and the number of iteration can be adjusted. Moreover, a three-stage network is utilized to connect multiple memory modules and multiple SISO decoders. After fabricated in 90nm process, the 2.1mm(2) chip can achieve 129Mb/s with 219mW for the 6144-bit block after 8 iterations.Item type:Item, A 188-size 2.1mm(2) Reconfigurable Turbo Decoder Chip with Parallel Architecture for 3GPP LTE System(2009) ;Wong, Cheng-Chi ;Lee, Yung-Yu ;Chang, Hsie-Chia ;電子工程學系及電子研究所Department of Electronics Engineering and Institute of ElectronicsThis paper presents a turbo decoder chip supporting all 188 block sizes in 3GPP LTE standard. The design allows 1, 2, 4, or 8 SISO decoders to concurrently process each block size, and the number of iteration can be adjusted. Moreover, a three-stage network is utilized to connect multiple memory modules and multiple SISO decoders. After fabricated in 90nm process, the 2.1mm(2) chip can achieve 129Mb/s with 219mW for the 6144-bit block after 8 iterations.Item type:Item, A 188-size 2.1mm(2) Reconfigurable Turbo Decoder Chip with Parallel Architecture for 3GPP LTE System(2009-01-01) ;Wong, Cheng-Chi ;Lee, Yung-Yu ;Chang, Hsie-Chia ;電子工程學系及電子研究所Department of Electronics Engineering and Institute of ElectronicsThis paper presents a turbo decoder chip supporting all 188 block sizes in 3GPP LTE standard. The design allows 1, 2, 4, or 8 SISO decoders to concurrently process each block size, and the number of iteration can be adjusted. Moreover, a three-stage network is utilized to connect multiple memory modules and multiple SISO decoders. After fabricated in 90nm process, the 2.1mm(2) chip can achieve 129Mb/s with 219mW for the 6144-bit block after 8 iterations.