Browsing by Author "Leon, Ka-Wai"

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Effect of moisture on electrical properties and reliability of low dielectric constant materials
(2014-02-01)
Cheng, Yi-Lung
;
Leon, Ka-Wai
;
Huang, Jun-Fu
;
Chang, Wei-Yuan
;
Chang, Yu-Min
The effect of absorbed moisture on the electrical characteristics and reliability of low dielectric constant materials (low-k) was investigated in this study. The experimental results reveal that porous low-k dielectrics absorb more moisture than dense low-k dielectrics. This absorbed moisture degrades the electrical performance and reliability of both classes of low-k dielectrics. Annealing at a higher temperature of 400 degrees C is required to decompose the physically-adsorbed moisture and thereby restore reliability performance. However, the chemically-adsorbed moisture seems to be difficult to remove by annealing at 400 degrees C, causing a degraded TDDB performance. Crown Copyright (C) 2013 Published by Elsevier B.V. All rights reserved.