Browsing by Author "Li, Chi-Kang"
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Item type:Item, 3D Finite Element Strain Analysis of V-Shaped Pits in Light Emitting Diodes(2015) ;Hsu, Chung-Cheng ;Wu, Chen-Kuo ;Li, Chi-Kang ;Lu, Tien-ChangWu, Yuh-RennIn this paper, we have analyzed the strain distribution of the V-pits in light emitting diodes (LEDs). The special geometry and non-uniform distribution introduce the complicated strain and piezoelectric distribution, where it might affect the carrier injection. In the future, we will combine the calculated piezoelectric field with our in-house developed 3D drift-diffusion model to figure out how the carrier inject into LEDs with V-pits.Item type:Item, 3D numerical modeling of the carrier transport and radiative efficiency for InGaN/GaN light emitting diodes with V-shaped pits(2016-05-01) ;Li, Chi-Kang ;Wu, Chen-Kuo ;Hsu, Chung-Cheng ;Lu, Li-ShuoLi, HengIn this paper, influence of a V-pit embedded inside the multiple quantum wells (MQWs) LED was studied. A fully three-dimensional stress-strain solver and Poisson-drift-diffusion solver are employed to study the current path, where the quantum efficiency and turn-on voltage will be discussed. Our results show that the hole current is not only from top into lateral quantum wells (QWs) but flowing through shallow sidewall QWs and then injecting into the deeper lateral QWs in V-pit structures, where the V-pit geometry provides more percolation length for holes to make the distribution uniform along lateral MQWs. The IQE behavior with different V-pit sizes, threading dislocation densities, and current densities were analyzed. Substantially, the variation of the quantum efficiency for different V-pit sizes is due to the trap-assisted nonradiative recombination, effective QW ratio, and ability of hole injections. (C) 2016 Author(s).Item type:Item, Characteristics of large-scale nanohole arrays for thin-silicon photovoltaics(2014-04-01) ;Chen, Ting-Gang ;Yu, Peichen ;Chen, Shih-Wei ;Chang, Feng-YuHuang, Bo-YuNanostructured crystalline silicon is promising for thin-silicon photovoltaic devices because of reduced material usage and wafer quality constraint. This paper presents the optical and photovoltaic characteristics of silicon nanohole (SiNH) arrays fabricated using polystyrene nanosphere lithography and reactive-ion etching (RIE) techniques for large-area processes. A post-RIE damage removal etching is subsequently introduced to mitigate the surface recombination issues and also suppress the surface reflection due to modifications in the nanohole sidewall profile, resulting in a 19% increase in the power conversion efficiency. We show that the damage removal etching treatment can effectively recover the carrier lifetime and dark current-voltage characteristics of SiNH solar cells to resemble the planar counterpart without RIE damages. Furthermore, the reflectance spectra exhibit broadband and omnidirectional anti-reflective properties, where an AM1.5 G spectrum-weighted reflectance achieves 4.7% for SiNH arrays. Finally, a three-dimensional optical modeling has also been established to investigate the dimension and wafer thickness dependence of light absorption. We conclude that the SiNH arrays reveal great potential for efficient light harvesting in thin-silicon photovoltaics with a 95% material reduction compared to a typical cell thickness of 200 mu m. Copyright (c) 2012 John Wiley & Sons, Ltd.Item type:Item, FABRICATION AND MODELING OF LARGE-SCALE SILICON NANOWIRE SOLAR CELLS FOR THIN-FILM PHOTOVOLTAICS(2012) ;Cheng, Yu-Chih ;Chen, Ting-Gang ;Chang, Feng-Yu ;Huang, Bo-YuPan, Huai-TeNanostructured crystalline silicon is promising for thin photovoltaic devices due to reduced material usage and wafer quality constraint. In this study, a simple and cost-effective method is presented for producing large-area silicon nanowire (SiNW) arrays with various lengths by employing the polystyrene nanosphere lithography and the metal-assisted chemical etching (MACE). The nanowire structure exhibits broadband and omnidirectional antireflection properties, where the lowest AM1.5G-spectrum-weighted reflectance of SiNW arrays is 4.38%, compared to 8.84% of the conventional single layer antireflection coating (SLARC). Next, we made SiNW array structures into solar cells and its power efficiency achieved 10.8%. Afterward, the SiNW array solar cells were analyzed by external and internal quantum efficiency measurement which shows the device performance primarily limited by direct and indirect interfacial recombination of charge carriers. We further develop a modeling technique based on three-dimensional (3) optical and two-dimensional (20) electrical simulations which are tailored for the nanostructured silicon photovoltaic devices. The optical simulation employs a rigorous couple wave analysis (RCWA) technique to calculate the distribution of electromagnetic field in order to obtain the generation rate within the nanostructure. Next, an electrical calculation is based on a 20 self-consistent drift-diffusion and Poisson solver using a finite element method (FEM). We investigate the influence to the device performance of carrier diffusion length with three different structures. The simulation results show that a short diffusion length does not seriously deteriorate the short-circuit current density and power conversion efficiency of a core-shell PN junction solar cell compared to the conventional planar structure. Our work suggests that SiNW solar cells can achieve efficient light harvesting and photoelectric conversion with less and lower-grade materials than the conventional technology, which is promising for thin silicon photovoltaics.Item type:Item, Three dimensional characterization of GaN-based light emitting diode grown on patterned sapphire substrate by confocal Raman and photoluminescence spectromicroscopy(2017-03-30) ;Li, Heng ;Cheng, Hui-Yu ;Chen, Wei-Liang ;Huang, Yi-HsinLi, Chi-KangWe performed depth-resolved PL and Raman spectral mappings of a GaN-based LED structure grown on a patterned sapphire substrate (PSS). Our results showed that the Raman mapping in the PSS-GaN heterointerface and the PL mapping in the InxGa1-xN/GaN MQWs active layer are spatially correlated. Based on the 3D construction of E2(high) Raman peak intensity and frequency shift, V-shaped pits in the MQWs can be traced down to the dislocations originated in the cone tip area of PSS. Detail analysis of the PL peak distribution further revealed that the indium composition in the MQWs is related to the residual strain propagating from the PSS-GaN heterointerface toward the LED surface. Numerical simulation based on the indium composition distribution also led to a radiative recombination rate distribution that shows agreement with the experimental PL intensity distribution in the InxGa1-xN/GaN MQWs active layer.Item type:Item, Three dimensional compressive strain and its effect on optical properties of GaN-based light emitting diode grown on patterned sapphire substrate by confocal spectromicroscopy(2017-01-01) ;Li, Heng ;Cheng, Hui-Yu ;Chen, Wei-Liang ;Huang, Yi-HsinLi, Chi-KangWe performed depth-resolved spectral mappings of GaN-based LED and results showed that the strain distribution propagating from PSS-GaN heterointerface toward surface and the PL intensity are spatially correlated. Numerical simulation based on indium composition distribution led to a radiative recombination rate distribution shows agreement with the experimental PL intensity distribution.