Browsing by Author "Liang, Chia-Wei"

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Heterogeneous Chip Integration Process for Flexible Wireless Microsystem Application
(2011-03-01)
Chao, Tzu-Yuan
;
Liang, Chia-Wei
;
Cheng, Y. T.
;
Kuo, Chien-Nan
;
電子工程學系及電子研究所
This paper presents a low-cost heterogeneous integration technology combining the previously developed bumpless radio-frequency (RF) system-on-a-package scheme with a special surface cleaning process to assemble a complementary metal-oxide-semiconductor chip with an organic substrate (SU-8/polydimethylsiloxane) by low-temperature Au-Au thermocompressive bonds (< 200 degrees C) for flexible wireless microsystem fabrication. The RF performance of -15 dB return loss and -0.25 dB insertion loss at 40 GHz and above 6 MPa bonding strength of a microstrip-to-coplanar-waveguide interconnect transition between the chip and the substrate make the technology practical for flexible wireless microsystem integration.