Browsing by Author "Liao, LC"

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Bioconversion with whole cell penicillin acylase in aqueous two-phase systems
(1999-07-01)
Liao, LC
;
Ho, CS
;
Wu, WT
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生物科技學系
;
Department of Biological Science and Technology
The deacylation of Pen G was carried out by using recombinant E. coli in an aqueous two-phase system consisting of polyethylene glycol and potassium phosphate solution, which partitions the cells to the bottom phase and the products to the top phase. Bioconversion and product separation were carried out in the same reactor. Repeated batch conversion was employed ten times and enzymic activity showed only a slight decline. When pure enzyme was used for bioconversion in an aqueous two-phase system, the decline was fast and bioconversion using whole cell penicillin acylase was better than that obtained using the pure acylase. (C) 1999 Elsevier Science Ireland Ltd. All rights reserved.
Embedded passive components for printed-circuit boards
(1999)
Wu, LK
;
Tseng, BC
;
Liao, LC
;
電信工程研究所
;
Institute of Communications Engineering
Demand for significant size reduction of circuitry used to build various portable products has increased rapidly in recent years. While significant strides have been made in the integration of active components, only little progress has been made in the integration of passive components. Together with the increasing circuit complexities to meet the increasing demand on a product's functionality, number of passive components used in a typical portable product has increased significantly in recent years and may account for 70-80% of the total part count. The embedded passives technology that was developed recently is aimed at integrating various passive components at the printed-circuit board level. By integrating these passives, manufacturers may obtain the following advantages: (1) a dramatic reduction in the overall part count, (2) improved wireability due to the elimination of vias, (3) improved reliability due to the elimination of solder joints, and (4) improved frequency response due to the elimination of parasitic inductance.
Integral passives in multi-dielectric substrate
(2000)
Wu, LK
;
Tseng, BC
;
Liao, LC
;
電信工程研究所
;
Institute of Communications Engineering
Integral passives technology has the potential for achieving denser packaging, more efficient manufacturing processes, better reliability and future replacement of many surface mount devices which will result in savings of volume, mass and cost To improve the circuit performance and obtain greater benefits of the integral passives, multi-dielectric substrates with layer-specific dielectric constant and thickness can be used to design the integral passives. With these different material characteristics we design various integral capacitors in a 6-layer printed wiring boards and then extract various circuit parameters associate with the frequency-dependent equivalent circuit models. From which a comparison between the experimentally measured characteristics and the simulated results of an RF amplifier will be demonstrated.