Browsing by Author "Lien, Der-Hsien"

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A Nanostructuring Method to Decouple Electrical and Thermal Transport through the Formation of Electrically Triggered Conductive Nanofilaments
(2018-07-12)
Retamal, Jose Ramon Duran
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Kang, Chen-Fang
;
Lien, Der-Hsien
;
Kuo, Wei-Cheng
;
Juang, Zhen-Yu
Transforming thermal energy into electric energy and vice versa needs the decoupling of electrical transport from thermal transport. An innovative strategy is proposed by forming/disrupting electrically triggered conductive nanofilaments within semiconducting thin films to switch thermoelectric properties between two states without further material modification and manufacturing processes. It can also controllably adjust the degree of decoupling, providing a potential resolution and performance adjustability for heat/coldness control or power consumption reduction on demand.
Few-Layer MoS2 with High Broadband Photogain and Fast Optical Switching for Use in Harsh Environments
(2013-05-01)
Tsai, Dung-Sheng
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Liu, Keng-Ku
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Lien, Der-Hsien
;
Tsai, Meng-Lin
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Kang, Chen-Fang
Few-layered MoS2 as Schottky metal-semiconductor-metal photodetectors (MSM PDs) for use In harsh environments makes its debut as two-dimensional (2D) optoelectronics with high broadband gain (up to 13.3), high detectivity (up to similar to 10(10) cm Hz(1/2)/W), fast photoresponse (rise time of similar to 70 mu s and fall time of similar to 110 mu s), and high thermal stability (at a working temperature of up to 200 degrees C). Ultrahigh responsivity (0.57 A/W) of few-layer MoS2 at 532 nm is due to the high optical absorption (similar to 10% despite being less than 2 nm in thickness) and a high photogain, which sets up a new record that was not achievable in 2D nanomaterials previously. This study opens avenues to develop 2D nanomaterial-based optoelectronics for harsh environments in imaging techniques and light-wave communications as well as in future memory storage and optoelectronic circuits.
Monolithic 3D CMOS Using Layered Semiconductors
(2016-04-06)
Sachid, Angada B.
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Tosun, Mahmut
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Desai, Sujay B.
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Hsu, Ching-Yi
;
Lien, Der-Hsien
Monolithic 3D integrated circuits using transition metal dichalcogenide materials and low-temperature processing are reported. A variety of digital and analog circuits are implemented on two sequentially integrated layers of devices. Inverter circuit operation at an ultralow supply voltage of 150 mV is achieved, paving the way to high-density, ultralow-voltage, and ultralow-power applications.