Browsing by Author "Lin, Chun-Ying"

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Design and fabrication of MEMS-based thermally-actuated image stabilizer for cell phone camera
(2012-11-01)
Lin, Chun-Ying
;
Chiou, Jin-Chern
;
電控工程研究所
;
Institute of Electrical and Control Engineering
A micro-electro-mechanical system (MEMS)-based image stabilizer is proposed to counteracting shaking in cell phone cameras. The proposed stabilizer (dimensions, 8.8 x 8.8 x 0.2 mm(3)) includes a two-axis decoupling XY stage and has sufficient strength to suspend an image sensor (IS) used for anti-shaking function. The XY stage is designed to send electrical signals from the suspended IS by using eight signal springs and 24 signal outputs. The maximum actuating distance of the stage is larger than 25 mu m, which is sufficient to resolve the shaking problem. Accordingly, the applied voltage for the 25 mu m moving distance is lower than 20 V: the dynamic resonant frequency of the actuating device is 4485 Hz, and the rising time is 21 ms. (c) 2012 Elsevier Ltd. All rights reserved.
Design, fabrication and actuation of a MEMS-based image stabilizer for photographic cell phone applications
(2010-07-01)
Chiou, Jin-Chern
;
Hung, Chen-Chun
;
Lin, Chun-Ying
;
電控工程研究所
;
Institute of Electrical and Control Engineering
This work presents a MEMS-based image stabilizer applied for anti-shaking function in photographic cell phones. The proposed stabilizer is designed as a two-axis decoupling XY stage 1.4 x 1.4 x 0.1 mm(3) in size, and adequately strong to suspend an image sensor for anti-shaking photographic function. This stabilizer is fabricated by complex fabrication processes, including inductively coupled plasma (ICP) processes and flip-chip bonding technique. Based on the special designs of a hollow handle layer and a corresponding wire-bonding assisted holder, electrical signals of the suspended image sensor can be successfully sent out with 32 signal springs without incurring damage during wire-bonding packaging. The longest calculated traveling distance of the stabilizer is 25 mu m which is sufficient to resolve the anti-shaking problem in a three-megapixel image sensor. Accordingly, the applied voltage for the 25 mu m moving distance is 38 V. Moreover, the resonant frequency of the actuating device with the image sensor is 1.123 kHz.
Design, fabrication and actuation of four-axis thermal actuating image stabiliser
(2011-07-01)
Lin, Chun-Ying
;
Chiou, Jin-Chen
;
電控工程研究所
;
Institute of Electrical and Control Engineering
Presented is a microelectromechanical system-based thermal actuating image stabiliser. The proposed stage has dimensions of 14.9 x 14.9 x 0.2 mm(3) and contains a four-axis decoupling XY stage used for anti-shaking. The processes used to fabricate the stabiliser include silicon on isolator process, inductively coupled plasma process and flip-chip bonding technique. The maximum actuating distance of the stage is larger than 25 mu m, which is sufficient to resolve the shaking problem in 3 x optical zoom condition. According to the experiment results, the supplied voltage for the 25 mu m moving distance is lower than 20 V, and the dynamic resonant frequency of the actuating device is 4.7 kHz.
Design, Fabrication, and Actuation of Micro-Electro-Mechanical System-Based Image Stabilizer
(2010)
Chiou, Jin-Chern
;
Hung, Chen-Chun
;
Lin, Chun-Ying
;
Lin, Yung-Jiun
;
電控工程研究所
In this investigation, we present a two dimensional high aspect ratio XY stage, designed as an image stabilizer. This stabilizer is 8 x 8 x 0.75 mm(3), and sufficiently strong to support a suspended image sensor for anti-shaking photographic function. This stabilizer is fabricated by the silicon-on-glass (SOG) process including inductively coupled plasma reactive ion etching (ICP-RIE) processes, in which the anchor layer, pre-etching layer and structure layers are identified without an additional release step as is required in traditional silicon-on-insulator (SOI) wafer etching process. When an actuator is fabricated, flip-chip bonding is adopted to attach a 3 megapixel image sensor to this device. The longest calculated traveling distance of the stabilizer is 25 mu m and special stoppers are designed to prevent the actuator from moving out of range, and sticking to the side by pull-in phenomenon. Accordingly, the applied voltage at the 25 mu m moving distance is 84 V. Furthermore, the dynamic resonant frequency of the actuating device with an image sensor is 1.013 kHz. (C) 2010 The Japan Society of Applied Physics
MEMS-based thermally-actuated image stabilizer for cellular phone camera
(2012-11-01)
Lin, Chun-Ying
;
Chiou, Jin-Chern
;
電控工程研究所
;
Institute of Electrical and Control Engineering
This work develops an image stabilizer (IS) that is fabricated using micro-electro-mechanical system (MEMS) technology and is designed to counteract the vibrations when human using cellular phone cameras. The proposed IS has dimensions of 8.8 x 8.8 x 0.3 mm(3) and is strong enough to suspend an image sensor. The processes that is utilized to fabricate the IS includes inductive coupled plasma (ICP) processes, reactive ion etching (RIE) processes and the flip-chip bonding method. The IS is designed to enable the electrical signals from the suspended image sensor to be successfully emitted out using signal output beams, and the maximum actuating distance of the stage exceeds 24.835 mu m when the driving current is 155 mA. Depending on integration of MEMS device and designed controller, the proposed IS can decrease the hand tremor by 72.5%.
Tilting Motion Control in Narrow Tilting Vehicle Using Double-Loop PID Controller
(2009)
Chiou, J. C.
;
Lin, Chun-Ying
;
Chen, Chih-Liang
;
Chien, Chin-Pin
;
電控工程研究所
This paper presents an electric narrow tilting vehicle (NTV), which is named Intelligent Personal Mobility (IPM). It can tilt to prevent from rollover. The tilting control strategy is also proposed and implemented by double-loop PID controller in this paper, the first loop controls the tilting rate, and the second loop which encloses the first loop controls the tilting position. This double-loop PIID controller was verified by working with IPM multibody model which had been verified by comparing with IPM in slalom tests. This approach can be adopted to solve instable problems of the others NTV systems.