Browsing by Author "Lin, Hau-Yu"

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Ge Epitaxial Growth on GaAs Substrates for Application to Ge-Source/Drain GaAs MOSFETs
(2010)
Luo, Guang-Li
;
Han, Zong-You
;
Chien, Chao-Hsin
;
Ko, Chih-Hsin
;
Wann, Clement H.
Ge films were epitaxially grown on GaAs(100) substrates and Ga(0.88)In(0.12)As(100) virtual substrates using an ultrahigh vacuum/chemical vapor deposition system. The incubation time of Ge growth depends on Ga(In)As surfaces that were processed by different wet chemical solutions. Growth behaviors, such as island growth at the initial stages and selective growth into recessed regions of GaAs, were studied by transmission electron microscopy. To test the quality of Ge grown on GaAs, an n(+)-Ge/p-GaAs diode was fabricated. We propose that through Ge selective epitaxial growth, Ge can be used as the source-drain of a GaAs metal-oxide-semiconductor field-effect transistor (MOSFET) to overcome some intrinsic limitations of this device. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3246000] All rights reserved.
III-V MOSFETs with a New Self-Aligned Contact
(2010)
Zhang, Xingui
;
Guo, Huaxin
;
Ko, Chih-Hsin
;
Wann, Clement H.
;
Cheng, Chao-Ching
We report the first demonstration of III-V n-MOSFETs with self-aligned contact technology. The self-aligned contact was formed using a salicide-like process which is compatible with CMOS process flow. A new epitaxy process was developed to selectively form a thin continuous germanium-silicon (GeSi) layer on gallium arsenide (GaAs) source and drain (S/D) regions. Nickel was deposited and annealed to form NiGeSi, and unreacted metal was removed. A second anneal diffuses Ge and Si into GaAs to form heavily n+ doped regions, and a novel self-aligned nickel germanosilicide (NiGeSi) ohmic contact was achieved. MOSFETs with the new self-aligned metallization process were realized.
Nearly Dislocation-free Ge/Si Heterostructures by Using Nanoscale Epitaxial Growth Method
(2012-01-01)
Luo, Guang-Li
;
Ko, Chih-Hsin
;
Wann, Clement H.
;
Chung, Cheng-Ting
;
Han, Zong-You
The selective growth of germanium into nanoscale trenches on silicon substrates was investigated. These nanoscale trenches-the smallest size of which was 50 nm-were fabricated using the state-of-the-art shallow trench isolation technique. The quality of the Ge films was evaluated using transmission electron microscopy. It was found that the formation of threading dislocations (TDs) was effectively suppressed when using this deposition technique. It was considered that for the Ge grown in nanoscale Si areas (e. g., several tens of nanometers), the TDs were readily removed during cyclic thermal annealing, predominantly because their gliding distance to the SiO2 sidewalls was very short. Therefore, nanoscale epitaxial growth technology can be used to deposit Ge films on lattice-mismatched Si substrates with a reduced defect density. (C) 2011 Published by Elsevier B.V. Selection and/or peer-review under responsibility of Garry Lee
Self-aligned contact metallization technology for III-V metal-oxide-semiconductor field effect transistors
(2011-05-01)
Zhang, Xingui
;
Guo, Huaxin
;
Lin, Hau-Yu
;
Cheng, Chao-Ching
;
Ko, Chih-Hsin
The demonstration of a salicidelike self-aligned contact technology for III-V metal-oxide-semiconductor field-effect transistors (MOSFETs) is reported. A thin and continuous crystalline germanium-silicon (GeSi) layer was selectively formed on n(+) doped gallium arsenide (GaAs) regions by epitaxy. A new self-aligned nickel germanosilicide (NiGeSi) Ohmic contact with good morphology was achieved using a two-step annealing process with precise conversion of the GeSi layer into NiGeSi. NiGeSi contact with the contact resistivity (rho(c)) of 1.57 Omega mm and sheet resistance (R(sh)) of 2.8 Omega/square was achieved. The NiGeSi-based self-aligned contact technology is promising for future integration in high performance III-V MOSFETs. (C) 2011 American Vacuum Society. [DOI: 10.1116/1.3592211]
The Annihilation of Threading Dislocations in the Germanium Epitaxially Grown within the Silicon Nanoscale Trenches
(2009)
Luo, Guang-Li
;
Huang, Shih-Chiang
;
Ko, Chih-Hsin
;
Wann, Clement H.
;
Chung, Cheng-Ting
We investigated the selective growth of germanium into nanoscale trenches on silicon substrates. These nanoscale trenches, the smallest size of which was 50 nm, were fabricated using the state-of-the-art shallow trench isolation technique. The quality of the Ge films was evaluated using transmission electron microscopy. The formation of threading dislocations (TDs) was effectively suppressed when using this deposition technique. For the Ge grown in nanoscale Si areas (e.g., several tens of nanometers), the TDs were probably readily removed during cyclic thermal annealing predominantly because their gliding distance to the SiO(2) sidewalls was very short. Therefore, nanoscale epitaxial growth technology can be used to deposit Ge films on lattice-mismatched Si substrates with a reduced defect density.