Browsing by Author "Lin, Liwei"

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3D PRINTED BIO-SENSING CHIP FOR THE DETERMINATION OF BACTERIA ANTIBIOTIC-RESISTANT PROFILE
(2019-01-01)
Yeh, Po-Chen
;
Chen, Juhong
;
Karakurt, Ilbey
;
Lin, Liwei
;
交大名義發表
This study presents a novel 3D printed bio-sensing chip to characterize the antibiotic-resistant reaction profile of bacteria in real time for the first time. The chip adapts the dead-end filling method to achieve the sample solution transfer process. The experimental results demonstrate several accomplishments: (1) fabrication of the disposable and real-time bacteria detection system by 3D-printing; (2) alleviation of the typical leakage problems associated with 3D-printed structures during the transfer process for the sample solutions; and (3) demonstration of the detection of E. coli-antibiotic tests using a smart phone with the RGB pixel analysis app with the color identification to achieve the bacteria antibiotic-resistant profile. As such, this work could open up a new class of disposable bio-sensing characterization systems based on the combination of 3D-printing and wireless data transmission technologies.
3D PRINTED RF PASSIVE COMPONENTS BY LIQUID METAL FILLING
(2015)
Yang, Chen
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Wu, Sung-Yueh
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Glick, Casey
;
Choi, Yun Seok
;
Hsu, Wensyang
We present three-dimensional (3D) micro-scale electrical components and systems by means of 3D printing and a liquid-metal-filling technique. The 3D supporting polymer structures with hollow channels and cavities are fabricated from inkjet printing. Liquid metals made of silver particles suspension in this demonstration are then injected into the hollow paths and solidified to form metallic elements and interconnects with high electrical conductivity. In the proof-of-concept demonstrations, various radio-frequency (RF) passive components, including 3D-shaped inductors, capacitors and resistors are fabricated and characterized. High-Q inductors and capacitors up to 1 GHz have been demonstrated. This work establishes an innovative way to construct arbitrary 3D electrical systems with efficient and labor-saving processes.
3D-printed microelectronics for integrated circuitry and passive wireless sensors
(2015-01-01)
Wu, Sung-Yueh
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Yang, Chen
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Hsu, Wensyang
;
Lin, Liwei
;
機械工程學系
Three-dimensional (3D) additive manufacturing techniques have been utilized to make 3D electrical components, such as resistors, capacitors, and inductors, as well as circuits and passive wireless sensors. Using the fused deposition modeling technology and a multiple-nozzle system with a printing resolution of 30 mu m, 3D structures with both supporting and sacrificial structures are constructed. After removing the sacrificial materials, suspensions with silver particles are injected subsequently solidified to form metallic elements/interconnects. The prototype results show good characteristics of fabricated 3D microelectronics components, including an inductor-capacitor-resonant tank circuitry with a resonance frequency at 0.53 GHz. A 3D "smart cap" with an embedded inductor-capacitor tank as the wireless passive sensor was demonstrated to monitor the quality of liquid food (e.g., milk and juice) wirelessly. The result shows a 4.3% resonance frequency shift from milk stored in the room temperature environment for 36 h. This work establishes an innovative approach to construct arbitrary 3D systems with embedded electrical structures as integrated circuitry for various applications, including the demonstrated passive wireless sensors.
RF WIRELESS LC TANK SENSORS FABRICATED BY 3D ADDITIVE MANUFACTURING
(2015)
Wu, Sung-Yueh
;
Yang, Chen
;
Hsu, Wensyang
;
Lin, Liwei
;
交大名義發表
We present wireless inductor-capacitor (LC) tank sensors constructed by the three-dimensional (3D) additive manufacturing technique. Fabricated 3D structures with hollow channels are filled with liquid metal (silver particles) to form basic electrical components including inductors and capacitors. In the prototype design, a radio-frequency (RF) LC tank with resonance frequency at 0.53 GHz is realized. This LC tank sensor is utilized in rapid detection of liquid food (e.g., milk and juice). Specifically, the resonant frequency of the LC tank changes as the dielectric constant of the liquid food deteriorates over time and the signals are detected via an inductively coupled reader wirelessly. In the preliminary tests, a 4.3% frequency shift for milk stored at room temperature after 36 hours was obtained. This work presents a new class of manufacturing concepts to construct arbitrary 3D electrical systems for wireless sensing applications.