Browsing by Author "Lin, S"

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Application of inverse problem algorithm for temperature uniformity in rapid thermal processing
(2002-01-01)
Lin, S
;
Chu, HS
;
機械工程學系
;
Department of Mechanical Engineering
This article presents a finite-difference-method formulation to the application of inverse problem algorithms for uniform temperature tracking of several different linear ramp-up rates in rapid thermal processing. A one-dimensional thermal model and temperature-dependent thermal properties of silicon wafers are used. The required incident-heat-flux profiles for temperature uniformity across 300-mm-diameter 0.775-mm-thick silicon wafer were intuitively evaluated. Our numerical results indicate theft temperature non-uniformity occurring during the ramp increase with the ramp-up rate. Although a linear ramp-up rate of 300 degreesC/s was used and random errors did reach 3.864 degreesC, the temperature over the wafer was maintained within 0.665 degreesC of the wafer center if the incident-heat-flux profiles were dynamically controlled according to the inverse results. These temperature non-uniformities could be acceptable in the advanced rapid thermal processing system. (C) 2002 Elsevier Science B.V. All rights reserved.
Designing a networked-sharing construction environment
(2002-09-01)
Lin, S
;
Sun, CT
;
Kao, G
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教育研究所
;
Institute of Education
Reuse of fresh water sludge in cement making
(2004)
Pan, JR
;
Huang, C
;
Lin, S
;
環境工程研究所
;
Institute of Environmental Engineering
With the increasing demand for high quality water, a large quantity of chemical agent must be added in the water purification process, which in turn generates enormous amount of fresh water sludge. Of all the options for sludge disposal, sludge reuse has been considered most economical and environmentally sound. This study evaluated the possibility of incorporating fresh water sludge in the making of Portland cement through the sintering process. The goal was to search for the optimal condition to maximize the replacement of clay with the fresh water sludge. Characteristics of fresh water sludge were collected and analyzed. The analysis showed that water source and water treatment process dominate the characteristics, particularly the chemical composition of the fresh water sludge. The fresh water sludge was mixed with the cement clay in various percentages, from 0% to 100%, as raw material for cement-making. The effects of its addition on the sintering condition and the quality of cement were evaluated. The analysis of the clinkers showed that the addition of the fresh water sludge did not change the phase form and the f-CaO content of the cement. The compressive strength of the masonry increased with the increasing addition of fresh water sludge. All cement products made from various replacement ratios met the Chinese National Standard of first degree Portland cement.
Synthesis of alpha-galactosyl ceramide and the related glycolipids for evaluation of their activities on mouse splenocytes
(2005-02-14)
Fan, GT
;
Pan, YS
;
Lu, KC
;
Cheng, YP
;
Lin, WC
Phytosphingosine and its short-chain analog were efficiently synthesized with 19% overall yield in 10 steps, respectively, starting from an inexpensive D-lyxose. Galactosyl donors of sulfide and phosphite types bearing benzoyl protecting groups of 4- and 6OH underwent glycosylation in excellent alpha-anomeric selectivity. A variety of alpha-galactosyl, fucosyl and glucosyl ceramides and serine-type lipids were prepared, and their activities involved in the proliferation of mouse splenocytes and the expression of cytokines were elucidated. Besides alpha-galactosyl ceramides, a galactosyl serine-type lipid also exhibited substantial effect on the expression of cytokines IFN-gamma and IL-4. (C) 2004 Elsevier Ltd. All rights reserved.
Thermal uniformity of 12-in silicon wafer during rapid thermal processing by inverse heat transfer method
(2000-11-01)
Lin, S
;
Chu, HS
;
機械工程學系
;
Department of Mechanical Engineering
Through an inverse heat transfer method, this paper presents a finite difference formulation for determination of incident heat fluxes to achieve thermal uniformity in a 12-in silicon wafer during rapid thermal processing. A one-dimensional thermal model and temperature-dependent thermal properties of a silicon wafer are adopted in this study. Our results show that the thermal nonuniformity ran be reduced considerably if the incident heat fluxes on the wafer are dynamically controlled according to the inverse-method results, An effect of successive temperature measurement errors on thermal uniformity is discussed. The resulting maximum temperature differences are only 0.618, 0.776, 0.981, and 0.326 degreesC for 4-, 6-, 8- and 12-in wafers, respectively, The required edge heating compensation ratio for thermal uniformity in 4-, 6-, 8- and 12-in silicon wafers is also evaluated.
Thermal uniformity of 12-in silicon wafer in linearly ramped-temperature transient rapid thermal processing
(2001-05-01)
Lin, S
;
Chu, HS
;
機械工程學系
;
Department of Mechanical Engineering
This paper presents a systematic method for estimating the dynamic incident-heat-flux profiles required to achieve thermal uniformity in 12-in silicon wafers during linearly ramped-temperature transient rapid thermal processing using the inverse heat-transfer method, A two-dimensional thermal model and temperature-dependent silicon wafer thermal properties are adopted in this study. The results show that thermal nonuniformities on the wafer surfaces occur during ramped increases in direct proportion to the ramp-up rate. The maximum temperature differences in the present study are 0.835 degreesC, 1.174 degreesC, and 1.516 degreesC, respectively, for linear 100 degreesC/s, 200 degreesC/s, and 300 degreesC/s ramp-up rates, Although a linear ramp-up rate of 300 degreesC/s was used and measurement errors did reach 3.864 degreesC, the surface temperature was maintained within 1.6 degreesC of the center of the wafer surface when the incident-heat-flux profiles were dynamically controlled according to the inverse-method approach. These thermal nonuniforimities could be acceptable in rapid thermal processing systems.
Using inverse modeling to estimate the incident heat flux required to achieve temperature uniformity across a circular disk
(2000-10-01)
Lin, S
;
Chu, HS
;
機械工程學系
;
Department of Mechanical Engineering
This article presents a systematic inverse modeling analysis for estimating the incident heat flux required to achieve temperature uniformity across a circular disk during thermal processing. A one-dimensional thermal model, temperature-dependent thermal properties of silicon, and a future-time algorithm of inverse heat transfer method are used. Vertical and lateral edge-heat compensations on the perimeter are discussed. The required edge-heat compensations for maintaining uniform temperature across 100-mm-diameter (0.6-min-thick), 150-mm-diameter (0.675-mm-thick), 200-mm-diameter (0.725-mm-thick), and 300-mm-diameter (0.775-mm-thick) silicon disks are evaluated intuitively using inverse modeling. Our numerical results show that temperature uniformity can be efficiently achieved using inverse modeling. The resulting maximum temperature differences in our present study were only 0.279, 0.583, 0.989, and 0.178 degreesC across 100-, 150-, 200- and 300-mm-diameter disks, respectively.