Browsing by Author "Lin, Yen-Han"

Now showing 1 - 4 of 4

An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem
(2017-04-01)
Hu, Yu-Chen
;
Huang, Yu-Chieh
;
Huang, Po-Tsang
;
Wu, Shang-Lin
;
Chang, Hsiao-Chun
In the traditional neural sensing microstructure, the limited metal line pitch and the metal layer numbers restrict the neural signal routing ability from electrodes to circuit chips. Miniature packaging and excessive noise interference bottlenecks are some of the challenges faced by the electrodes and circuit chips integration with traditional wire bonding. This paper proposes a 2.5-D heterogeneous integration neural sensing microsystem based on the silicon substrate to overcome these issues. With standard semiconductor and 3-D integration processes, high-channel-density (256 channels at 25 mm(2)) neural sensing microsystem is achieved. Through silicon via provides the shortest vertical interconnection and dramatically minimizes the packaging. Furthermore, the interposer can carry multiple chips to enhance the function of the biosensor. Electrical characteristics and reliability examinations reveal its high quality and great performance as compared to traditional approaches. This novel highly integrated neural sensing microsystem is expected to contribute to the biomedical field for exploring and solving unknown biological mysteries.
An Ultra-High-Density 256-channel/25mm(2) Neural Sensing Microsystem using TSV-embedded Neural Probes
(2016)
Huang, Yu-Chieh
;
Huang, Po-Tsang
;
Wu, Shang-Lin
;
Hui, Yu-Chen
;
You, Yan-Huei
Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm(2) neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable mu-needles, TSV-embedded mu-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable mu-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm x 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8 mu W for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42 mu W and 0.036 mm(2). The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.
Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable mu-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits
(2016)
Huang, Yu-Chieh
;
Hu, Yu-Chen
;
Huang, Po-Tsang
;
Wu, Shang-Lin
;
You, Yan-Huei
Local brain connectivity is expected to lead to new models for neurological diseases, which may in turn result in advanced understanding and better treatment. This paper presents a neural sensing microsystem integrated with TSV-embedded dissolvable mu-needles array, ENIG bonding technology, biocompatible Au-TSV flexible interposer and neural recording circuits, for neural sensing implantation. An ultra-thin film bonding approach is proposed for integration of interposer assembly. Removing bonding wire by proposed bonding technology, the dimension of neural sensing system can be minimized to reduce surgical area and promote implant success rate. The signal quality of neural recording can be significantly improved by eliminating complex signal paths with 2.5D TSV integration from neural sensing interface to neural recording circuits.
Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes
(2017-10-01)
Huang, Yu-Chieh
;
Huang, Po-Tsang
;
Wu, Shang-Lin
;
Hu, Yu-Chen
;
You, Yan-Huei
Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 x 5 mm(2) is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable mu-needles, TSV-embedded mu-probes, 256-channel neural amplifiers, 11-bit area-power-efficient successive approximation register analog-to-digital converters, and serializers. This microsystem can detect 256 electrocorticography and local field potential signals within a small area of 5 mm x 5 mm. The neural amplifier realizes 57.8 dB gain with only 9.8 mu W per channel. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing. A smaller microsystem with dimension of 6 mm x 4 mm has been also implanted into rat brain for somatosensory evoked potentials (SSEPs) recording by using contralateral and ipsilateral electrical stimuli with intensity from 0.2 to 1.0 mA, and successfully observed different SSEPs from left somatosensory cortex of a rat.