Browsing by Author "Lin, Yi-Lung"

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Design of AC-Coupled Circuit for High-speed Interconnects
(2012)
Huang, Chun-Wei
;
Liu, Kai-Jen
;
Huang, Yu-Jung
;
Chen, Ming-Kun
;
Lin, Yi-Lung
The scaling of semiconductor technology together with 3D IC stacking integration make it possible for many portable electronics to process large amount of multimedia data. AC-coupling enables chip placed face-to-face for signal transmission using close-field capacitive coupling. A high performance system design using AC coupled interconnect (ACCI) technology not only achieves shorter and faster interconnection between dies but also increases packaging density. This paper describes a chip-to-chip circuit design suitable for high-speed 3DIC interconnected applications. The AC-Coupled face-to-face (F2F) chip was simulated using HSPICE with TSMC 0.18-mu m 1P6M CMOS technology process file under a 1.8 V supply voltage. The simulation results indicated the proposed circuit with the self-test characteristics can achieve differential signal transmission up to 2.5 Gbps.