Browsing by Author "Liu, Guan-Ru"

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Analysis of anomalous traps measured by charge pumping technique in HfO2/metal gate n-channel metal-oxide-semiconductor field-effect transistors
(2012-12-03)
Ho, Szu-Han
;
Chang, Ting-Chang
;
Lu, Ying-shin
;
Lo, Wen-Hung
;
Chen, Ching-En
This letter investigates anomalous traps measured by charge pumping technique in high voltage in HfO2/metal gate n-channel metal-oxide-semiconductor field-effect transistors. N-V-high level characteristic curves with different duty ratios indicate that the electron discharge time dominates the value of N for extra traps. By fitting ln (N (t(base level) = 2.5 mu s)-N (t(base level)))-Delta t(base level) at different temperatures and computing the equation t = tau(0) exp (alpha(e,SiO2)d(SiO2) + alpha(e,HfO2)d(HfO2,trap)), results show that these extra traps measured by the charge pumping technique at high voltage can be attributed to high-k bulk shallow traps. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4769444]
Anomalous Gate Current Hump after Dynamic Negative Bias Stress and Negative-Bias Temperature-Instability in p-MOSFETs with HfxZr1-xO2 and HfO2/Metal Gate Stacks
(2013)
Ho, Szu-Han
;
Chang, Ting-Chang
;
Wu, Chi-Wei
;
Lo, Wen-Hung
;
Chen, Ching-En
In this study, the authors investigated an anomalous gate current hump after dynamic negative bias stress (NBS) and negative-bias temperature-instability (NBTI) in HfxZr1-xO2 and HfO2/metal gate p-channel metal-oxide-semiconductor field-effect transistors. This result is attributed to hole trapping in high-k bulk. Measuring gate current under initial through body floating and source/drain floating conditions indicates that holes flow from source/drain to gate. The fitting of the gate current-gate voltage characteristic curve demonstrates that Frenkel-Poole mechanism dominates the conduction under initial. Next, fitting the gate current after dynamic NBS and NBTI indicates Frenkel-Poole then tunneling mechanisms, finally returning to the Frenkel-Poole mechanism. These phenomena can be attributed to hole trapping in high-k bulk and the formula Ehigh-k epsilon(high-k) = Q + E-sio2 epsilon(sio2). To further understand the gate current hump, both Zr-undoped and 8 similar to 10% Zr-doped in high-k bulk devices were used for comparisons. These results indicate that initial gate current is also a significant factor in generating the anomalous gate current hump, and all results obey the hump generation condition of J(Tunneling) << J(Frenkel-Poole). (C) 2013 The Electrochemical Society. All rights reserved.
Bipolar Resistive RAM Characteristics Induced by Nickel Incorporated Into Silicon Oxide Dielectrics for IC Applications
(2012-12-01)
Tsai, Tsung-Ming
;
Chang, Kuan-Chang
;
Chang, Ting-Chang
;
Syu, Yong-En
;
Chuang, Siang-Lan
In this letter, we successfully produced resistive switching behaviors by nickel doped into silicon oxide at room temperature. The nickel element was doped into silicon oxide, which is a useful dielectric material in integrated circuit (IC) industries by cosputtering technology. Based on the proposed method, satisfactory reliability of the resistance switching device can be demonstrated by endurance and retention evaluation. We believe that the silicon oxide doped with nickel at room temperature is a promising method for resistive random access memory nonvolatile memory applications due to its compatibility with the IC processes.
Characteristics and Mechanisms of Silicon-Oxide-Based Resistance Random Access Memory
(2013-03-01)
Chang, Kuan-Chang
;
Tsai, Tsung-Ming
;
Chang, Ting-Chang
;
Wu, Hsing-Hua
;
Chen, Jung-Hui
Traditionally, a large number of silicon oxide materials are extensively used as various dielectrics for semiconductor industries. In general, silicon oxide cannot be used as resistance random access memory (RRAM) due to its insulating electrical properties. In this letter, we have successfully produced resistive switching and forming-free behaviors by zinc doped into silicon oxide. The current-voltage fitting data show that current transport mechanism is governed by Poole-Frenkel behavior in high-resistance state and Ohm's law in low-resistance state, consisting with filament theory. Additionally, good endurance and retention reliabilities are exhibited in the zinc-doped silicon oxide RRAM.
Impact of strain on gate-induced floating body effect for partially depleted silicon-on-insulator p-type metal-oxide-semiconductor-field-effect-transistors
(2013-01-15)
Lo, Wen-Hung
;
Chang, Ting-Chang
;
Dai, Chih-Hao
;
Chung, Wan-Lin
;
Chen, Ching-En
This work investigates impact of mechanical strain on gate-induced-floating-body-effect (GIFBE) for partially depleted silicon-on-insulator p-type metal-oxide-semiconductor field effect transistors (PD SOI p-MOSFETs). First part, the original mechanism of GIFBE on PD SOI p-MOSFETs is studied. The experimental results indicate that GIFBE causes a reduction in oxide electric field (E-ox), resulting in an underestimate of negative-bias temperature instability (NBTI) degradation. This can be attributed to the electrons tunneling from the process-induced partial n(+) poly gate and anode electron injection (AEI) model, rather than the electron valence band tunneling (EVB) widely accepted as the mechanism for n-MOSFETs. And then, the second part shows that the strained FB device has less NBTI degradation than the unstrained devices. This behavior can be attributed to the fact that more electron accumulation was induced by strain-induced band gap narrowing, reducing NBTI significantly. (c) 2012 Elsevier B.V. All rights reserved.
Improvement mechanism of resistance random access memory with supercritical CO2 fluid treatment
(2014-01-01)
Chang, Kuan-Chang
;
Chen, Jung-Hui
;
Tsai, Tsung-Ming
;
Chang, Ting-Chang
;
Huang, Syuan-Yong
We demonstrated that the supercritical CO2 fluid treatment was a new concept to efficiently reduce the operation current of resistance random access memory. The dangling bonds of tin-doped silicon oxide (Sn:SiOx) thin film were passivated by the hydration-dehydration reaction through supercritical CO2 fluid treatment, which was verified by the XPS and FTIR analyses. The current conduction mechanism of low resistance state in post-treated Sn:SiOx thin film was transferred to hopping conduction from Ohmic conduction. Furthermore, the current conduction mechanism of high resistance state in the memory device was transferred to Schottky emission from Frenkel-Poole conduction. The phenomena were attributed to the discontinuous metal filament formed by hydration-dehydration reaction in Sn:SiOx thin film through supercritical fluid treatment. Finally, a reaction model was proposed to explain the mechanism of current reduction in Sn:SiOx thin film with supercritical CO2 fluid treatment. Crown Copyright (C) 2013 Published by Elsevier B.V. All rights reserved.
Investigation of an anomalous hump in gate current after negative-bias temperature-instability in HfO2/metal gate p-channel metal-oxide-semiconductor field-effect transistors
(2013-01-07)
Ho, Szu-Han
;
Chang, Ting-Chang
;
Wu, Chi-Wei
;
Lo, Wen-Hung
;
Chen, Ching-En
This Letter investigates a hump in gate current after negative-bias temperature-instability (NBTI) in HfO2/metal gate p-channel metal-oxide-semiconductor field-effect transistors. Measuring gate current at initial through body floating and source/drain floating shows that hole current flows from source/drain. The fitting of gate current (I-g)-gate voltage (V-g) characteristic curves demonstrates that the Frenkel-Poole mechanism dominates the conduction. Next, by fitting the gate current after NBTI, in the order of Frenkel-Poole then tunneling, the Frenkel-Poole mechanism can be confirmed. These phenomena can be attributed to hole trapping in high-k bulk and the electric field formula Ehigh-k epsilon(high-k) = Q+E-sio2 epsilon(sio2). (C) 2013 American Institute of Physics. [http://dx.doi.org/10.1063/1.4773479]
Investigation of extra traps measured by charge pumping technique in high voltage zone in p-channel metal-oxide-semiconductor field-effect transistors with HfO2/metal gate stacks
(2013-01-07)
Ho, Szu-Han
;
Chang, Ting-Chang
;
Wang, Bin-Wei
;
Lu, Ying-Shin
;
Lo, Wen-Hung
This letter investigates extra traps measured by charge pumping technique in the high voltage zone in p-channel metal-oxide-semiconductor field-effect transistors with HfO2/metal gate stacks. N-V-high level characteristic curves with different duty ratios show that the hole discharge time (t(base level)) dominates the value of extra traps. By fitting ln (N (t(base level) = 1 mu s) -N (t(base level))) - Delta t(base level) at different temperatures and computing the equation t = tau(0) exp (alpha(h,SiO2)d(SiO2) + alpha(h,HfO2)d(HfO2,trap)), the results show that these extra traps measured by the charge pumping technique at high voltage zone can be attributed to high-k bulk shallow traps. (C) 2013 American Institute of Physics. [http://dx.doi.org/10.1063/1.4773914]
Investigation of Lateral Trap Position by Random Telegraph Signal Analysis in Moderate Inversion in n-Channel MOSFETs
(2013)
Chen, Ching-En
;
Chang, Ting-Chang
;
You, Bo
;
Lo, Wen-Hung
;
Ho, Szu-Han
This paper investigates the trap position by random telegraph signal (RTS) analysis in moderate inversion in partially depleted silicon-on-insulator n-channel metal-oxide-semiconductor field-effect transistors. In the diffusion current-dominated region, the electron concentration distribution is more non-uniform along the channel than the one in the drift current-dominated region. In the diffusion region, the application of drain (source) voltage can influence the potential at the drain (source) side only. Accordingly, the position of oxide trap can be further clarified using RTS measurements to compare both the capture times as well as the relative channel current amplitudes of devices with and without interchanged source/drain. (C) 2013 The Electrochemical Society. All rights reserved.
Origin of Hopping Conduction in Sn-Doped Silicon Oxide RRAM With Supercritical CO2 Fluid Treatment
(2012-12-01)
Tsai, Tsung-Ming
;
Chang, Kuan-Chang
;
Chang, Ting-Chang
;
Chang, Geng-Wei
;
Syu, Yong-En
In this letter, we investigate the origin of hopping conduction in the low-resistance state (LRS) of a resistive random access memory device with supercritical CO2 fluid treatment. The dangling bonds of a tin-doped silicon oxide (Sn:SiOx) thin film were cross linked by the hydration-dehydration reaction through supercritical fluid technology. The current conduction mechanism of the LRS in the posttreated Sn:SiOx thin film was transferred to hopping conduction from Ohmic conduction, owing to isolation of metal tin in the Sn:SiOx thin film by hydration-dehydration reaction. The phenomena can be verified by our proposed reaction model, which is speculated by the X-ray photoelectron spectroscopy analyses.