Browsing by Author "Liu, Y. S."

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Sequence-dependent scheduling with order deliveries
(2013-10-01)
Lin, B. M. T.
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Yin, P. Y.
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Liu, Y. S.
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資訊管理與財務金融系註：原資管所+財金所
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Department of Information Management and Finance
This paper studies a sequence-dependent scheduling problem incorporating order delivery, motivated by satellite imaging scheduling. A set of jobs is to be processed on a single machine and each job belongs to a specific group. The completion time of a group is the moment when all jobs belonging to this group are completed. The problem is to determine a processing sequence of the jobs such that the sum of weighted completion times over all groups is minimized. We present a binary integer program to formulate the studied problem and then develop an O(n(2)2(n)) dynamic programming algorithm for determining optimal solutions. To produce approximate solutions within an acceptable time, we design a tabu search algorithm, an iterated local search algorithm and a genetic algorithm. Computational experiments are conducted to study the performance of the integer program and the solution algorithms. Numerical statistics suggest that the binary integer program can reach optimal solutions faster than the integer program existing in the literature, and the iterated local search algorithm outperforms other approaches when the number of jobs increases. (C) 2013 Elsevier Inc. All rights reserved.
Temperature-dependent yield effects on composite beams used in CMOS MEMS
(2013-03-01)
Kuo, F. Y.
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Chang, C. S.
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Liu, Y. S.
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Wen, K. A.
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Fan, L. S.
This paper presents an experimentally verified analytical model of temperature-dependent yield effects on the curvatures of composite beam structures used in complementary metal-oxide semiconductor microelectromechanical systems (CMOS MEMS). The temperature-dependent effects on composite beam curvatures of a thermal process can be predicted by extracting key parameters from the measured curvatures of a limited number of CMOS MEMS composite-layer combinations. The effects due to thermal history in MEMS packaging, which change the characteristics of beam curvatures due to material yield, are further analyzed. The models are verified with measured results from beam structures fabricated by an application-specific integrated circuit-compatible 0.18 mu m 1P6M CMOS MEMS process using a white light interferometer. These models can be applied in electronic design automation tools to provide good prediction of temperature-dependent properties related to CMOS MEMS beam curvature, such as sensing capacitance, for monolithic sensor system on chip design.