Browsing by Author "Lu, J. Q."

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Fabrication of Nano-Scale Cu Bond Pads with Seal Design in 3D Integration Applications
(2011-04-01)
Chen, K. N.
;
Tsang, C. K.
;
Wu, W. W.
;
Lee, S. H.
;
Lu, J. Q.
A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO(2) CMP process and dilute HF wet etching. In addition, in order to achieve improved wafer-level bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.