Browsing by Author "Nguyen, H. Q."

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Control of metamorphic buffer structure and device performance of InxGa1-xAs epitaxial layers fabricated by metal organic chemical vapor deposition
(2014-12-05)
Nguyen, H. Q.
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Yu, H. W.
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Luc, Q. H.
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Tang, Y. Z.
;
Phan, V. T. H.
Using a step-graded (SG) buffer structure via metal-organic chemical vapor deposition, we demonstrate a high suitability of In0.5Ga0.5As epitaxial layers on a GaAs substrate for electronic device application. Taking advantage of the technique\'s precise control, we were able to increase the number of SG layers to achieve a fairly low dislocation density (similar to 10(6)cm(-2)), while keeping each individual SG layer slightly exceeding the critical thickness (similar to 80 nm) for strain relaxation. This met the demanded but contradictory requirements, and even offered excellent scalability by lowering the whole buffer structure down to 2.3 mu m. This scalability overwhelmingly excels the forefront studies. The effects of the SG misfit strain on the crystal quality and surface morphology of In0.5Ga0.5As epitaxial layers were carefully investigated, and were correlated to threading dislocation (TD) blocking mechanisms. From microstructural analyses, TDs can be blocked effectively through self-annihilation reactions, or hindered randomly by misfit dislocation mechanisms. Growth conditions for avoiding phase separation were also explored and identified. The buffer-improved, high-quality In0.5Ga0.5As epitaxial layers enabled a high-performance, metal-oxide-semiconductor capacitor on a GaAs substrate. The devices displayed remarkable capacitance-voltage responses with small frequency dispersion. A promising interface trap density of 3 x 10(12) eV(-1) cm(-2) in a conductance test was also obtained. These electrical performances are competitive to those using lattice-coherent but pricey InGaAs/InP systems.
Effect of graded-temperature arsenic prelayer on quality of GaAs on Ge/Si substrates by metalorganic vapor phase epitaxy
(2011-10-24)
Yu, H. W.
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Chang, E. Y.
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Yamamoto, Y.
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Tillack, B.
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Wang, W. C.
The growth of GaAs epitaxy on Ge/Si substrates with an arsenic prelayer grown with graded temperature ramped from 300 to 420 degrees C is investigated. It is demonstrated that the graded-temperature arsenic prelayer grown on a Ge/Si substrate annealed at 650 degrees C not only improves the surface morphology (roughness: 1.1 nm) but also reduces the anti-phase domains' (APDs) density in GaAs epitaxy (dislocation density: similar to 2 x 10(7) cm(-2)). Moreover, the unwanted interdiffusion between Ge and GaAs epitaxy is suppressed by using the graded-temperature arsenic prelayer due to the low energy of the Ge-As bond and the use of a low V/III ratio of 20. (C) 2011 American Institute of Physics. [doi:10.1063/1.3656737]
Effect of substrate misorientation on the material properties of GaAs/Al(0.3)Ga(0.7)As tunnel diodes
(2010-12-06)
Yu, H. W.
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Chang, E. Y.
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Nguyen, H. Q.
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Chang, J. T.
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Chung, C. C.
The effect of substrate misorientation on the material quality of the N(++)-GaAs/P(++)-AlGaAs tunnel diodes (TDs) grown on these substrates is investigated. It is found that the misorientation influences both surface roughness and interface properties of the N(++)-GaAs/P(++)-AlGaAs TDs. Smooth surface (rms roughness: 1.54 angstrom) and sharp interface for the GaAs/Al(0.3)Ga(0.7)As TDs were obtained when the (100) tilted 10 degrees off toward [111] GaAs substrate was used. Besides, the oxygen content in N(++)-GaAs and P(++)-AlGaAs layers grown on the 10 degrees off GaAs substrates was reduced due to the reduction of sticking coefficient and number of anisotropic sites. (C) 2010 American Institute of Physics. [doi:10.1063/1.3525158]
Effect of substrate misorientation on the material properties of GaAs/Al0.3Ga0.7As tunnel diodes
(2010-12-06)
Yu, H. W.
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Chang, E. Y.
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Nguyen, H. Q.
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Chang, J. T.
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Chung, C. C.
The effect of substrate misorientation on the material quality of the N++-GaAs/P++-AlGaAs tunnel diodes (TDs) grown on these substrates is investigated. It is found that the misorientation influences both surface roughness and interface properties of the N++-GaAs/P++-AlGaAs TDs. Smooth surface (rms roughness: 1.54 angstrom) and sharp interface for the GaAs/Al0.3Ga0.7As TDs were obtained when the (100) tilted 10 degrees off toward [111] GaAs substrate was used. Besides, the oxygen content in N++-GaAs and P++-AlGaAs layers grown on the 10 degrees off GaAs substrates was reduced due to the reduction of sticking coefficient and number of anisotropic sites. (C) 2010 American Institute of Physics. [doi:10.1063/1.3525158]
Electrical Characterization of Al(2)O(3)/n-InAs Metal-Oxide-Semiconductor Capacitors With Various Surface Treatments
(2011-06-01)
Trinh, H. D.
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Brammertz, G.
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Chang, E. Y.
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Kuo, C. I.
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Lu, C. Y.
Ex situ sulfide and HCl wet chemical treatments in conjunction with in situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al(2)O(3) on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. The capacitance-voltage C-V characterization of Al(2)O(3)/n-InAs structures shows that the frequency dispersion in the accumulation regime is small (< 0.75%/dec) and does not seem to be significantly affected by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the n-channel metal-oxide-semiconductor capacitors. The interface trap density profiles extracted from the simulation mainly show donorlike interface states inside the InAs band gap and in the lower part of the conduction band. The donorlike traps inside the InAs band gap and in the lower part of the conduction band were significantly reduced by using wet-chemical-plus-TMA treatments, in agreement with C-V characteristics.
Electrical Characterization of Al2O3/n-InAs Metal-Oxide-Semiconductor Capacitors With Various Surface Treatments
(2011-06-01)
Trinh, H. D.
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Brammertz, G.
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Chang, E. Y.
;
Kuo, C. I.
;
Lu, C. Y.
Ex situ sulfide and HCl wet chemical treatments in conjunction with in situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al2O3 on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. The capacitance-voltage C-V characterization of Al2O3/n-InAs structures shows that the frequency dispersion in the accumulation regime is small (< 0.75%/dec) and does not seem to be significantly affected by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the n-channel metal-oxide-semiconductor capacitors. The interface trap density profiles extracted from the simulation mainly show donorlike interface states inside the InAs band gap and in the lower part of the conduction band. The donorlike traps inside the InAs band gap and in the lower part of the conduction band were significantly reduced by using wet-chemical-plus-TMA treatments, in agreement with C-V characteristics.
Experimental and modeling on atomic layer deposition Al2O3/n-InAs metal-oxide-semiconductor capacitors with various surface treatments
(2011-01-01)
Trinh, H. D.
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Chang, E. Y.
;
Brammertz, G.
;
Lu, C. Y.
;
Nguyen, H. Q.
Ex-situ sulfide and HCl wet chemical treatments in conjunction with in-situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al2O3 on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. Capacitance-voltage (C-V) characterization of Al2O3/n-InAs structures shows that the frequency dispersion in accumulation regime is small (<0.75% per decade) and does not seem to be affected significantly by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the nMOS capacitors. The interface trap density profiles extracted from simulation show mainly donor-like interface states inside the InAs bandgap and in the lower part of the conduction band. The donor-like traps inside the InAs bandgap and in the lower part of the conduction band were significantly reduced by using wet chemical plus TMA treatments, in agreement with C-V characteristics.
Experimental and modeling on atomic layer deposition Al2O3/n-InAs metal-oxide-semiconductor capacitors with various surface treatments
(2011-01-01)
Trinh, H. D.
;
Chang, E. Y.
;
Brammertz, G.
;
Lu, C. Y.
;
Nguyen, H. Q.
Ex-situ sulfide and HCl wet chemical treatments in conjunction with in-situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al2O3 on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. Capacitance-voltage (C-V) characterization of Al2O3/n-InAs structures shows that the frequency dispersion in accumulation regime is small (<0.75% per decade) and does not seem to be affected significantly by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the nMOS capacitors. The interface trap density profiles extracted from simulation show mainly donor-like interface states inside the InAs bandgap and in the lower part of the conduction band. The donor-like traps inside the InAs bandgap and in the lower part of the conduction band were significantly reduced by using wet chemical plus TMA treatments, in agreement with C-V characteristics.
In0.5Ga0.5As-Based Metal-Oxide-Semiconductor Capacitor on GaAs Substrate Using Metal-Organic Chemical Vapor Deposition
(2013-01-01)
Nguyen, H. Q.
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Trinh, H. D.
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Chang, E. Y.
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Lee, C. T.
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Wang, Shin Yuan
We demonstrate the good-performance In0.5Ga0.5As-based metal-oxide-semiconductor capacitor (MOSCAP) on GaAs substrate using metal-organic chemical vapor deposition technique. In0.5Ga0.5As film grown on GaAs substrate is proved to be high quality with threading dislocation density as low as 10(6) cm(-2). The performance of the MOSCAPs is comparable to that of In0.53Ga0.47As/InP-based devices grown by molecular beam epitaxy technique. The devices show a nice capacitance-voltage response, with small frequency dispersion. The parallel conductance contours show the free movement of Fermi level with the gate bias. Acceptable interface trap density D-it values of 5 x 10(11)-2 x 10(12) eV(-1) . cm(-2) in the energy range of 0.64-0.52 eV above the InGaAs valence band maximum in In0.5Ga0.5As/GaAs MOSCAPs obtained by conductance methods were shown.
The influences of surface treatment and gas annealing conditions on the inversion behaviors of the atomic-layer-deposition Al(2)O(3)/n-In(0.53)Ga(0.47)As metal-oxide-semiconductor capacitor
(2010-07-26)
Trinh, H. D.
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Chang, E. Y.
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Wu, P. W.
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Wong, Y. Y.
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Chang, C. T.
The inversion behaviors of atomic-layer-deposition Al(2)O(3)/n-In(0.53)Ga(0.47)As metal-oxide-semiconductor capacitors are studied by various surface treatments and postdeposition annealing using different gases. By using the combination of wet sulfide and dry trimethyl aluminum surface treatment along with pure hydrogen annealing, a strong inversion capacitance-voltage (C-V) response is observed, indicating a remarkable reduction in interface trap state density (D(it)) at lower half-part of In(0.53)Ga(0.47)As band gap. This low D(it) was confirmed by the temperature independent C-V stretch-out and horizontal C-V curves. The x-ray photoelectron spectroscopy spectra further confirm the effectiveness of hydrogen annealing on the reduction of native oxides. (C) 2010 American Institute of Physics. [doi:10.1063/1.3467813]
The influences of surface treatment and gas annealing conditions on the inversion behaviors of the atomic-layer-deposition Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor capacitor
(2010-07-26)
Trinh, H. D.
;
Chang, E. Y.
;
Wu, P. W.
;
Wong, Y. Y.
;
Chang, C. T.
The inversion behaviors of atomic-layer-deposition Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor capacitors are studied by various surface treatments and postdeposition annealing using different gases. By using the combination of wet sulfide and dry trimethyl aluminum surface treatment along with pure hydrogen annealing, a strong inversion capacitance-voltage (C-V) response is observed, indicating a remarkable reduction in interface trap state density (D-it) at lower half-part of In0.53Ga0.47As band gap. This low D-it was confirmed by the temperature independent C-V stretch-out and horizontal C-V curves. The x-ray photoelectron spectroscopy spectra further confirm the effectiveness of hydrogen annealing on the reduction of native oxides. (C) 2010 American Institute of Physics. [doi:10.1063/1.3467813]