Browsing by Author "Peng, CJ"

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Development of low-temperature wafer level vacuum packaging for microsensors
(1999)
Huang, WF
;
Shie, JS
;
Lee, C
;
Gong, SC
;
Peng, CJ
Wafer level packaging received lots of attention in microsystems recently. Because it shows the potential to reduce the packaging cost, while the yield of devices after dicing and packaging can be increased. However, there is a limitation of commercialized wafer bonding technology, i.e., the high process temperature, such as 1000 degrees C of silicon fusion bonding, and 450 degrees C of anodic bonding. A novel low temperature wafer bonding with process temperature lower than 160 degrees C is proposed, it applies the In-Sn alloy to form the interface of wafer bonding. The experiment results show helium leak test of 6x10(-9)torr-liter/sec, and a tensile strength as high as 200kg/cm(2). Reliability test after 1500 temperature cycles between -10 to 80 degrees C also shows no trace of degradation compared to the initial quality of the samples. This low temperature soldering process demonstrates its promising potential at the wafer level packaging in industrial production.
Miniaturized microwave passive filter incorporating multilayer synthetic quasi-TEM transmission line
(2005-09-01)
Wu, HS
;
Yang, HJ
;
Peng, CJ
;
Tzuang, CKC
;
電信工程研究所
This paper presents a novel approach to miniaturizing a transmission-line (TL)-based bandpass filter (BPF). The BPF is miniaturized by incorporating multilayer stacked synthetic quasi-TEM TLs made of complementary conducting strip (CCS) metal surfaces. The stacked CCS TLs are separated by a meshed ground plane, whose coupling effect was experimentally shown negligibly to affect desired circuit performance. A brief description of the symmetric third-order TL filter synthesis procedure is reported to map such an idealized BPF to the prototype made of the stacked synthetic CCS TLs. Excellent agreement is obtained by comparing the experimental and theoretical filter frequency responses showing a 2.46-dB insertion loss, a -16.8-dB return loss with under 5% offset of low-side out-band transmission zeros, and a 2% offset of center frequency. A quick estimate of the proposed miniaturized filter design based on synthetic quasi-TEM lines shows that the particular filter prototype approaches the process limit.