Browsing by Author "Peng, YM"

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The effect of indium impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage
(1997-09-01)
Lin, W
;
Tu, GC
;
Lin, CF
;
Peng, YM
;
材料科學與工程學系
The effects of indium impurity on the etched morphology of high purity aluminium foils for electrolytic capacitor usage were investigated. The indium impurity was present either in as-received aluminium foils or deposited purposely on the foil surface through immersion-reduction reaction. The rolling line effect can be improved through introducing deposited indium on foil surfaces by immersion of the foil into In(NO3)(3) solution prior to DC-etching. Under a high immersion temperature and more concentrated Ir(NO3)(3) condition, surface etching competes with tunnel etching, and the foil thickness clearly decreases. Under low temperature and dilute In(NO3)(3) condition, surface etching is inhibited and tunnel etching prevails. The different DC-etching behaviour under the two In-deposition conditions is explained through the energy state difference between the two deposited-In and the activation energy difference between surface etching and tunnel etching. The modification of etchability by indium on aluminium surface is stronger than that of lead. This facilitates employing lower temperature and dilute In(NO3)(3) condition in the immersion-reduction process to optimize the etchability. (C) 1997 Elsevier Science Ltd.
The effect of lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage
(1996-06-01)
Lin, W
;
Tu, GC
;
Lin, CF
;
Peng, YM
;
材料科學與工程學系
The effects of lead impurity on the etched morphology of high purity aluminum foils for electrolytic capacitor applications were investigated in this work. The lead impurity was either present in as-received aluminum foils or deposited purposely on the foil surface through an immersion-reduction reaction. The amount and distribution of deposited lead varies with the lead content in as-received foil. The as-received foil with higher lead content gave a higher concentration and a more uniform distribution of deposited lead. Uniformly distributed vertical tunnel etchings were obtained when high lead foil, formed by immersion as-received high lead foil in Pb(NO3)(2) solution, was subject to DC-etching. For the as-received lower lead foils, the deposited lead was concentrated in rolling lines which resulted in surface etching along rolling lines. Both the surfacial and cross-sectional etching morphologies are presented in this study, together with the etching mechanism discussed. Copyright (C) 1996 Elsevier Science Ltd.
The effect of lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage
(1996-06-01)
Lin, W
;
Tu, GC
;
Lin, CF
;
Peng, YM
;
材料科學與工程學系
The effects of lead impurity on the etched morphology of high purity aluminum foils for electrolytic capacitor applications were investigated in this work. The lead impurity was either present in as-received aluminum foils or deposited purposely on the foil surface through an immersion-reduction reaction. The amount and distribution of deposited lead varies with the lead content in as-received foil. The as-received foil with higher lead content gave a higher concentration and a more uniform distribution of deposited lead. Uniformly distributed vertical tunnel etchings were obtained when high lead foil, formed by immersion as-received high lead foil in Pb(NO3)(2) solution, was subject to DC-etching. For the as-received lower lead foils, the deposited lead was concentrated in rolling lines which resulted in surface etching along rolling lines. Both the surfacial and cross-sectional etching morphologies are presented in this study, together with the etching mechanism discussed. Copyright (C) 1996 Elsevier Science Ltd.