Browsing by Author "Quang-Ho Luc"

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Characterizations of GaN Films Grown on Si (111) Substrates with Various Growth Temperatures of Multiple AlN Buffer Layers
(2012)
Binh-Tinh Tran
;
Chang, Edward Yi
;
Lin, Kung-Liang
;
Luong, Tien-Tung
;
Yu, Hung-Wei
We present the effect of multiple AlN buffer layers on characterizations of GaN film quality, which includes a thin high-low-high-temperature (HLHT) AlN buffer layers. The study is based on two different thicknesses of the GaN films on the buffers and found that the HLHT AlN buffer layers could significantly affect on the GaN films qualities. The buffer plays a very important role for the growth of GaN film on Si (111) substrate. The GaN film with an uniformly faceted surface and very high-quality has been obtained at the optimized multiple HLHT AlN buffer layers of 50-nm-thick at 1010-800-1010 degrees C.
Demonstrating 1 nm-oxide-equivalent-thickness HfO2/InSb structure with unpinning Fermi level and low gate leakage current density
(2013-09-30)
Hai-Dang Trinh
;
Lin, Yueh-Chin
;
Minh-Thuy Nguyen
;
Hong-Quan Nguyen
;
Quoc-Van Duong
In this work, the band alignment, interface, and electrical characteristics of HfO2/InSb metaloxide-semiconductor structure have been investigated. By using x-ray photoelectron spectroscopy analysis, the conduction band offset of 1.78 +/- 0.1 eV and valence band offset of 3.35 +/- 0.1 eV have been extracted. The transmission electron microscopy analysis has shown that HfO2 layer would be a good diffusion barrier for InSb. As a result, 1 nm equivalent-oxide-thickness in the 4 nm HfO2/InSb structure has been demonstrated with unpinning Fermi level and low leakage current of 10(-4) A/cm(-2). The D-it value of smaller than 10(12) eV(-1) cm(-2) has been obtained using conduction method. (C) 2013 AIP Publishing LLC.
Effect of annealing processes on the electrical properties of the atomic layer deposition Al2O3/In0.53Ga0.47As metal oxide semiconductor capacitors
(2014-04-01)
Quang-Ho Luc
;
Chang, Edward Yi
;
Trinh, Hai-Dang
;
Hong-Quan Nguyen
;
Binh-Tinh Tran
The influence of different annealing processes including post deposition annealing (PDA) and post metallization annealing (PMA) with various temperatures (250-400 degrees C) and ambient [N-2 and forming gas (FG)] on the electrical characteristics of Pt/Al2O3/In0.53Ga0.47As MOSCAPs are systemically studied. Comparing to samples underwent high PDA temperature, the higher leakage current has been observed for all of samples underwent high PMA temperature. This has resulted in the degradation of capacitance-voltage (C-V) behaviors. In conjunction with the current-voltage (J-V) measurement, depth profiling Auger electron spectroscopy (AES) and high-resolution transmission electron microscopy (HRTEM) analyses evidence that the out-diffusion of metal into oxide layer is the main source of leakage current. The noticeable passivation effect on the Al2O3/InGaAs interface has also been confirmed by the samples that underwent PDA process. (C) 2014 The Japan Society of Applied Physics
HfO2/AIN/ln(0.53)Ga(0.47)As MOS Devices Electrical Properties and Reliability Studies
(2016-01-01)
Yi-Chang, Edward
;
Quang-Ho Luc
;
Huy-Binh Do
;
Chang, Po-Chun
;
Lin, Yueh-Chin
In this article, we demonstrate plasma-enhanced atomic layer deposition (PEALD) as an effective passivation technique to establish high interfacial quality of high-kllnGaAs structures. Performing PEALD-AlN as an interfacial passivation layer (IPL), excellent capacitance-voltage (C-V) characteristics have been achieved for the HfO2/n, p-In0.53Ga0.47As MOSCAPs. The effects of AlN-IPL on the effective work function (EWF) of metal and band alignment of the HfO2/AlN/In0.53Ga0.47As structure have also been investigated. In addition, the multilayer TiNi alloys were applied as gate dielectric for a suitable metal EWF with a small work function variation (WFV). A sub-nm equivalent oxide thickness (EOT) HfO2/AlN/In0.53Ga0.47As MOS device with low density of interface states and low leakage current density was obtained utilizing AlN-IPL and post remote-plasma (PRP) gas as pre- and post-gate treatments in an in-situ ALD process. The device performance and reliability of HfO2/AlN/In0.53Ga0.47As nMOSFETs with in-situ PEALD treatments have also been characterized.
Influence of post deposition annealing temperatures on electrical properties of Al2O3/InSb MOSCAPs
(2012-01-01)
Hai-Dang Trinh
;
Lin, Yue-Chin
;
Chang, Edward Yi
;
Hong-Quan Nguyen
;
Wang, Shin-Yuan
The influence of post deposition annealing (PDA) temperatures on electrical characteristics of Al2O3/InSb metal-oxide-semiconductor capacitor (MOSCAP) structures is investigated. Low frequency C-V responses with strong inversion behavior in the whole range of measured frequency (100 Hz-1 MHz) are observed, indicating very short minority carrier response time in InSb. The PDA temperature of 300 degrees C and above would result in the reduction of maximum capacitance. At the PDA temperature of above 300 degrees C the C-V hysteresis, frequency dispersion and stretch out increases significantly, indicating the degradation of the MOSCAP structures. The degradation might relate to the interdiffusion between Al2O3 and InSb during thermal steps.
Performance Improvement of InGaAs FinFET Using NH3 Treatment
(2017-01-01)
Chang, Edward Yi
;
Quang-Ho Luc
;
Huy-Binh Do
;
Lin, Yueh-Chin
;
材料科學與工程學系
A marked improvement in the performance and reliability of In0.53Ga0.47As FinFETs have been demonstrated by applying an in situ remote-plasma gas (PRP) treatment. Under nitrogen passivation effects, an excellent immunity to short channel effects (SCEs) is shown for the scaled In0.53Ga0.47As FinFETs. The positive bias temperature instability (PBTI) measurements indicate that the NH3 plasma-treated In0.53Ga0.47As FinFETs are quite reliable with a small threshold voltage shift and a long-term operation. These results suggest that the in situ PRP treatment could be a key process for high-k dielectric technology for the sub-nanometer III-V MOS related devices.