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Browsing by Author "Reif, R."

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    Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes
    (2010-12-01)
    Chen, K. N.
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    Zhu, Y.
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    Wu, W. W.
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    Reif, R.
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    材料科學與工程學系
    This paper investigates and reviews the effects of wafer bow in three- dimensional (3D) integration bonding schemes, including copper wafer bonding and oxide fusion wafer bonding with silicon on insulator (SOI)-based layer transfer technology. Wafer bow criteria for good bonding quality and fabrication techniques to minimize wafer bow are introduced for 3D integration technology and applications.