<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css">

Browsing by Author "Shen, Ting-Ting"

Now showing 1 - 1 of 1
  • Thumbnail Image
    Item type:Item,
    Investigation of Low Temperature Cu/In Bonding in 3D Integration
    (2015)
    Hsieh, Yu-Sheng
    ;
    Shen, Ting-Ting
    ;
    Chien, Yu-San
    ;
    Chen, Kuan-Neng
    ;
    Shinozaki, Yuko
    Low temperature (< 180 degrees C) Cu/In bonding scheme in wafer-level is successfully developed. The bonded sample represents robust bonding quality and passes mechanical tests. The inter-diffusion mechanism and IMC phases are investigated by EDX and EELS. In addition, the specific contact resistance of Cu/In chip is measured approximately 3 x 10(-9) Omega-cm(2) by modified Kelvin feature, demonstrating excellent electrical characteristics. Good stability is also observed from reliability tests, including current stressing, TCT and un-bias HAST. Therefore, this low temperature Cu/In bonding scheme provides a promising method for dense vertical interconnects.