Browsing by Author "Shie, JS"

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A micromachined silicon-submount package for vertical emission of edge emitting laser diodes
(2000-05-15)
Shie, JS
;
Yu, SH
;
光電工程學系
;
Department of Photonics
A silicon-submount package structured with vertical emission of edge emitting laser diodes (LDs) is addressed. Utilizing the micromachining technique, a (100) silicon wafer can be engraved into a batch of submount structures having 45 degrees-slant mirrors for light deflection, and mesas for precise die dwelling. The mirrors are fabricated by deep V-groove etching with the etching window aligned to [100] crystal direction, and by multiple cycles of oxidation-and-isotropic etching processes. The initial ridged surface can thus be polished to a final roughness below 30 nm, with 100-mu m depth, sufficient to accommodate the vertically extended angle of a laser beam. Gold plating on the surface is patterned to form reflective mirrors on the slopes individually, and to provide the bases, which are connected to common electrode, for electroplating of thick indium pads selectively on the mesa areas. Self-alignment of LD bars or dice soldered right on the mesas can be achieved by the surface-tension mechanism that existed between the LD gold electrodes and the indium pads during melting. With simple TO-5 package, a vertically emitted beam has been observed on a stacked LD-submount device, as expected. (C) 2000 Elsevier Science S.A. All rights reserved.
A sensitive Pirani vacuum sensor and the electrothermal SPICE modelling
(1996-05-01)
Chou, BCS
;
Chen, YM
;
OuYang, M
;
Shie, JS
;
交大名義發表
A sensitive micro-Pirani vacuum sensor has been fabricated. With effective schemes of ambient-temperature compensation and stabilization, it is capable of measuring vacuum pressure linearly from 1 torr down to 10(-7) torr, a three orders-of-magnitude improvement in resolution over conventional gauges. A special electrothermal SPICE model, complementary to the conventional analog representation of thermal parameters, is also proposed. It allows a high-level sensor-circuit integrated simulation based on the most fundamental principle and thermal variables. Good agreement between the measured data obtained from a constant-temperature readout circuit and the simulation result is demonstrated.
An innovative Pirani pressure sensor
(1997)
Chou, BCS
;
Shie, JS
;
交大名義發表
;
光電工程學系
;
National Chiao Tung University
A conventional Pirani vacuum sensor is converted into a device able to measure high gas pressure. By referring to infinite pressure, heat-loss change from the reference to a measured pressure induces electrical signal on the resistive sensor. 0.3 mu m shallow gap is formed for the floating microsensors to increase its sensitivity. This results ire a measurable range from 10(5) down to 10(-1) Torr. The thermal microsensor differs from the piezoresistive or capacitive type in sensing mechanisms. It also has advantages in smaller size and simpler structure.
Analysis of optimal bolometer sensitivity with linear approximation
(1996)
Shie, JS
;
Chen, YM
;
Sheen, CS
;
光電工程學系
;
Department of Photonics
Application studies of a simulated low density room-temperature IRFPA
(1998)
Lee, TS
;
Shie, JS
;
Li, HT
;
光電工程學系
;
Department of Photonics
Recent developed thermal imagers using room-temperature IRFPA detectors have stimulated great opportunity in many commercial applications. This paper studies the possibility of using a low-density array detector for low-cost security-and-fire applications. Features on human body and plume were extracted by their infrared signatures. The human information was obtained from his spatial distribution, while a hazardous plume was supplemented with an additional temporal distribution. The function of a smaller array (less than or equal to 64x64) sensor was implemented by a high-resolution (320x240) commercial uncooled system through image downward re-sampling and pre-processing. Trade-off study between the recognition accuracy and the array size are also analyzed.
Characterization and modeling of metal-film microbolometer
(1996-12-01)
Shie, JS
;
Chen, YM
;
Mang, OY
;
Chou, BCS
;
光電工程研究所
The characteristic thermal parameters of a platinum-film microbolometer are extracted from the data of two measuring methods, A simple and accurate equivalent circuit model, along with its thermal behavior, is proposed for the device. Applying the model to simulate some device circuits results in good agreement with the experimental data, Furthermore, an effective method of ambient temperature compensation, proposed previously by our laboratory, is demonstrated both experimentally and by simulation using the same model. The established electro-thermal model therefore serves as an useful tool for SPICE simulations in the design of microbolometers.
Characterization and modeling of metal-film microbolometer
(1996-12-01)
Shie, JS
;
Chen, YM
;
Mang, OY
;
Chou, BCS
;
交大名義發表
The characteristic thermal parameters of a platinum-film microbolometer are extracted from the data of two measuring methods, A simple and accurate equivalent circuit model, along with its thermal behavior, is proposed for the device. Applying the model to simulate some device circuits results in good agreement with the experimental data, Furthermore, an effective method of ambient temperature compensation, proposed previously by our laboratory, is demonstrated both experimentally and by simulation using the same model. The established electro-thermal model therefore serves as an useful tool for SPICE simulations in the design of microbolometers.
Design and analysis of electrically calibrated tympanic thermometers
(1998-05-01)
Ou-Yang, M
;
Shie, JS
;
Tsao, C
;
光電工程學系
;
Department of Photonics
A new tympanic thermometer is analyzed and tested experimentally. An electrically calibrated pyroelectric detector of special configuration is employed to determine a person's body temperature. An energy-storage, power-supply-isolated capacitor is used as the electrical heating reference. The new thermometer design has an accuracy within +/-0.1 degrees C with a 90% confidence and is immune to ambient temperature, detector aging, and parameter variations. An equivalent-circuit model is established in the analysis to account for the heat exchanges among the tympanum, the surroundings, and the detector as well as for the electrothermal behavior of the detector. The model provides effective simulation of the thermometer with PSPICE. Critical parameters governing the accuracy and the Limitation of the tympanic thermometer are also pointed out by the simulation. (C) 1998 Optical Society of America.
Design and characterization of high-temperature-resolution thermometer
(2006-02-01)
Shie, JS
;
Hwang, TSD
;
光電工程學系
;
Department of Photonics
Thermochromic liquid crystals (TLCs) can serve as a light valve when it is carefully controlled by temperature. With a photodiode used in light transmissive intensity electric output voltage extraction, there is a progressive increase in output voltage from 19.331 to 35.800 degrees C, and the resolution is 0.0001482 degrees C, which decreases progressively to 0.03086 degrees C. If we design a linear integrated circuit with many very small sections for converting nonlinear extraction voltage to its relative temperature automatically, this system can serve as a thermometer. The whole system can be made portable for radiation temperature measurement.
Development of low-temperature wafer level vacuum packaging for microsensors
(1999)
Huang, WF
;
Shie, JS
;
Lee, C
;
Gong, SC
;
Peng, CJ
Wafer level packaging received lots of attention in microsystems recently. Because it shows the potential to reduce the packaging cost, while the yield of devices after dicing and packaging can be increased. However, there is a limitation of commercialized wafer bonding technology, i.e., the high process temperature, such as 1000 degrees C of silicon fusion bonding, and 450 degrees C of anodic bonding. A novel low temperature wafer bonding with process temperature lower than 160 degrees C is proposed, it applies the In-Sn alloy to form the interface of wafer bonding. The experiment results show helium leak test of 6x10(-9)torr-liter/sec, and a tensile strength as high as 200kg/cm(2). Reliability test after 1500 temperature cycles between -10 to 80 degrees C also shows no trace of degradation compared to the initial quality of the samples. This low temperature soldering process demonstrates its promising potential at the wafer level packaging in industrial production.
Efficient chip counting system with a modified scanner
(1998-09-01)
Lee, TS
;
Shie, JS
;
光電工程學系
;
Department of Photonics
A low-cost imaging system capable of recognizing and counting semiconductor good dice is designed and is proven experimentally to be effective. The system utilizes a commercial scanner with the least modification of its inner optics by a beamsplitter-insertion method. Patterns on specular die surfaces therefore can be grabbed clearly, which results in the marks on defective dice being distinguishable. Also, a mask algorithm is developed to count the good dice on an adhesive tape, according to the gray-level histogram and the converted binary picture of the scanned image. The built-in software associated with the scanner, which is reliable and user-friendly, can also be incorporated into the designated algorithm without paying an additional price for system development, (C) 1998 Society of Photo-Optical Instrumentation Engineers.
Fabrication and study of a shallow-gap Pirani vacuum sensor with a linearly measurable atmospheric pressure range
(1999-01-01)
Chou, BCS
;
Chen, CN
;
Shie, JS
;
光電工程研究所
;
Institute of EO Enginerring
A Pirani vacuum sensor with a shallow gap between its heated element and its surrounding substrate heat-sink was fabricated using polysilicon as a sacrificial layer. The polysilicon was post-etched by TMAH solution, and an anti-stiction method was used in several steps of the process including a crucial freeze-drying one. The smallest spacing in this device is 0.3 mu m, and via this narrow gap, the heat conductance from the gas-molecule-collisions from the hot element to the heat sink is greatly enhanced in the atmospheric pressure regime. Therefore, this Pirani vacuum sensor is capable of detecting gas pressure linearly up to around 7 bars. As for the low-pressure regime, a partial dummy compensation method reduces the ambient temperature drift effectively and pressure lower than 10(-3) Torr was measurable. Moreover, device packaging was also studied to protect the tiny sensor from any contamination including dust and particles.
Fabrication and study of a shallow-gap Pirani vacuum sensor with a linearly measurable atmospheric pressure range
(1999-01-01)
Chou, BCS
;
Chen, CN
;
Shie, JS
;
光電工程學系
;
Department of Photonics
A Pirani vacuum sensor with a shallow gap between its heated element and its surrounding substrate heat-sink was fabricated using polysilicon as a sacrificial layer. The polysilicon was post-etched by TMAH solution, and an anti-stiction method was used in several steps of the process including a crucial freeze-drying one. The smallest spacing in this device is 0.3 mu m, and via this narrow gap, the heat conductance from the gas-molecule-collisions from the hot element to the heat sink is greatly enhanced in the atmospheric pressure regime. Therefore, this Pirani vacuum sensor is capable of detecting gas pressure linearly up to around 7 bars. As for the low-pressure regime, a partial dummy compensation method reduces the ambient temperature drift effectively and pressure lower than 10(-3) Torr was measurable. Moreover, device packaging was also studied to protect the tiny sensor from any contamination including dust and particles.
Fabrication of a sensitive germanium microbolometer for tympanic thermometry
(1999-01-01)
Chen, CN
;
Shie, JS
;
光電工程研究所
;
Institute of EO Enginerring
Fabrication of a complementary-metal-oxide-semiconductor (CMOS)-process-compatible microbolometer for tympanic thermometry using an amorphous germanium thin film as the temperature-sensitive element has been studied. Heat treatment of the deposited films, with or without passivation, at different annealing temperatures was investigated for optimizing the sensitivity of the material and for considering the compatibility of the CMOS process. Microbolometers structured with a thermally isolated membrane to enhance the thermal responsivity were fabricated by micromachining. The fabricated devices were characterized by conducting appropriate experiments and evaluated for the necessary thermal and electrical parameters useful in applications. It has been found that, for an annealing condition around 370 degrees C for two hours, the passivated floating Ge thermistor has a 3%/degrees C temperature coefficient of resistance (TCR) and a comparably low flicker noise relative to other conditions. In a vacuum, the passivated device with an area of 250x250 mu m(2) shows a responsivity up to 400 kV/W at 1 Hz, and a normalized detectivity D* of 1.2x10(8) and 5.2x10(7) cmHz(1/2)/W at 3 Hz and 30 Hz, respectively. These measured values also prove that the device, in its current structure, can be used as a sensitive radiation detector for tympanic thermometers.
Fabrication of a sensitive germanium microbolometer for tympanic thermometry
(1999-01-01)
Chen, CN
;
Shie, JS
;
光電工程學系
;
Department of Photonics
Fabrication of a complementary-metal-oxide-semiconductor (CMOS)-process-compatible microbolometer for tympanic thermometry using an amorphous germanium thin film as the temperature-sensitive element has been studied. Heat treatment of the deposited films, with or without passivation, at different annealing temperatures was investigated for optimizing the sensitivity of the material and for considering the compatibility of the CMOS process. Microbolometers structured with a thermally isolated membrane to enhance the thermal responsivity were fabricated by micromachining. The fabricated devices were characterized by conducting appropriate experiments and evaluated for the necessary thermal and electrical parameters useful in applications. It has been found that, for an annealing condition around 370 degrees C for two hours, the passivated floating Ge thermistor has a 3%/degrees C temperature coefficient of resistance (TCR) and a comparably low flicker noise relative to other conditions. In a vacuum, the passivated device with an area of 250x250 mu m(2) shows a responsivity up to 400 kV/W at 1 Hz, and a normalized detectivity D* of 1.2x10(8) and 5.2x10(7) cmHz(1/2)/W at 3 Hz and 30 Hz, respectively. These measured values also prove that the device, in its current structure, can be used as a sensitive radiation detector for tympanic thermometers.
Fabrication of low-stress dielectric thin-film for microsensor applications
(1997-12-01)
Chou, BCS
;
Shie, JS
;
Chen, CN
;
光電工程研究所
;
Institute of EO Enginerring
A method of fabricating low-stress dielectric thin film as the supporting material of micromachined devices is reported. The film is processed by post thermal oxidation of silicon-rich nitride (SN) deposited on silicon substrate by LPCVD. Due to the compensation on the nitride by its top oxide, an ultra-low residual less than 10 MPa can be obtained with proper oxidation scheme. Characteristics of the oxidized nitride were analyzed by Auger electron spectroscopy (AES) and ellipsometry. Large floating membranes of 4 x 4 cm(2) and 400-nm thick can be made by this method with TMAH etching.
Fabrication of low-stress dielectric thin-film for microsensor applications
(1997-12-01)
Chou, BCS
;
Shie, JS
;
Chen, CN
;
交大名義發表
;
光電工程學系
A method of fabricating low-stress dielectric thin film as the supporting material of micromachined devices is reported. The film is processed by post thermal oxidation of silicon-rich nitride (SN) deposited on silicon substrate by LPCVD. Due to the compensation on the nitride by its top oxide, an ultra-low residual less than 10 MPa can be obtained with proper oxidation scheme. Characteristics of the oxidized nitride were analyzed by Auger electron spectroscopy (AES) and ellipsometry. Large floating membranes of 4 x 4 cm(2) and 400-nm thick can be made by this method with TMAH etching.
Fabrication of narrow-band self-filtering GaAs photodetector by epitaxy
(2005-11-01)
Shie, JS
;
Hwang, TSD
;
光電工程學系
;
Department of Photonics
A narrow-band self-filtering (NBSF) GaAs photodiode has been fabricated by the LPE technique, where epilayers of high-low-high N doping were grown on a P-type substrate. By proper control of the thickness and doping concentration of each layer, it can be demonstrated that the fabricated NBSF detector has a spectral bandwidth as narrow as 315 angstrom at 880 nm peak wavelength. This means over 98% of the blue-side light is suppressible, indicating that the NBSF photodetector is a useful device for many applications where the suppression of high background light is necessary. (c) 2005 American Institute of Physics.
Feasibility study on a contact-less direct thermal printing with electrothermal SPICE simulation
(2001-02-15)
Chen, YM
;
Shie, JS
;
光電工程學系
;
Department of Photonics
A new concept for making contact-less direct thermal printing for facsimile is proposed and evaluated in this article. The concept is based on the fact that air molecules can be a good thermal conduction medium capable of transferring the heat efficiently from a micro-heater to a thermal marking paper, if both in close proximity, The micro-heater can be made of single-crystal silicon by micromachining technology, hence the associated CMOS driving circuits can be fabricated monolithically with the heater to exempt from the tedious work of numerous wire bonding. An illustrative device of integrated micro-heater array in 200 dpi resolution has been fabricated, characterized and evaluated for the new printing application. A thermal model of the device has also been set up and studied of its dynamic behaviors using the existing electrothermal SPICE package. The result of simulations indicates that efficient energy transfer of more than 40%, much better than the conventional performance, can be achieved with a practical 1 mum air gap. This and other additional advantages described in the article indicates that, in principle, the contact-less direct thermal printing is feasible and the monolithic silicon micro-heater array can be an excellent device for this application. (C) 2001 Elsevier Science B.V. All rights reserved.
Feasibility study on low-resolution uncooled thermal imagers for home-security applications
(2000-06-01)
Lee, TS
;
Shie, JS
;
光電工程學系
;
Department of Photonics
The feasibility of using low-resolution thermal imagers for home security applications is analyzed, taking low cost as the primary consideration. The smallest possible sensor size and resolution are chosen as the operative criteria and derived by simulation, in accordance with the optical constraints of a general home security system and the minimum target feature recognizable using image processing. Low-resolution simulated thermal images were generated by downgrading the high-resolution images captured by an uncooled IR camera, through sampling and modification. Caricatures of human beings and family pets are extracted for recognition using aspect-ratio and neural network methods, which are compared with one another for detection probability. It is demonstrated that highly reliable detection of human beings or pets with a minimal target feature of 8x8 pixels can be obtained using the neural network method. Also, a fire can be detected early using its temporal size variation and higher temperature. Finally, low-cost fabrication of the proposed low-resolution passive infrared imaging system with an uncooled FPA sensor utilizing a fully standard application-specific IC CMOS process is also discussed in detail, (C) 2000 Society of Photo-Optical Instrumentation Engineers.