Browsing by Author "Song, Yen-Fang"

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30 nm resolution x-ray imaging at 8 keV using third order diffraction of a zone plate lens objective in a transmission microscope
(2006-11-27)
Yin, Gung-Chian
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Song, Yen-Fang
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Tang, Mau-Tsu
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Chen, Fu-Rong
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Liang, Keng S.
A hard x-ray transmission microscope with 30 nm spatial resolution has been developed employing the third diffraction order of a zone plate objective. The microscope utilizes a capillary type condenser with suitable surface figure to generate a hollow cone illumination which is matched in illumination range to the numerical aperture of the third order diffraction of a zone plate with an outmost zone width of 50 nm. Using a test sample of a 150 nm thick gold spoke pattern with finest half-pitch of 30 nm, the authors obtained x-ray images with 30 nm resolution at 8 keV x-ray energy. (c) 2006 American Institute of Physics.
A LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE
(2017-01-01)
Yang, Tsung-Han
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Guo, Zi-Li
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Fu, Yu-Min
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Cheng, Yu-Ting
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Song, Yen-Fang
The paper presents a low temperature (with 60 degrees C) inkjet printing and filling process to realize low resistive Ag TSV (Through Substrate Vias) with the aspect ratio of via depth vs. diameter from 2 to 5 in a SU-8 substrate potential for flexible microsystem packaging applications. Combining humidity control and layer-by-layer Ag mirror reaction, the proposed process technology can accomplish a fully filled TSV with the lowest electrical resistivity of similar to 450 mu Omega.cm in comparison with the prior printing and filling technologies.
Autoionizing Rydberg series (np ', nf ') of Ar investigated by stepwise excitations with lasers and synchrotron radiation
(2008-08-01)
Lee, Yin-Yu
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Dung, Tzan-Yi
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Hsieh, Re-Ming
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Yuh, Jih-Young
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Song, Yen-Fang
Synchrotron radiation is used to excite Ar to the intermediate states 3p(1/2)(5) (3d '[3/2](1), 5d '[3/2](1), 5s '[1/2](1,) 7s '[1/2](1)) and 3p(3/2)(5) (6d[1/2](1), 6d[3/2](1), 8s[3/2](1)), then excited by lasers to the autoionizing Rydberg series 3p(1/2)(5) np ' ([1/2](0,1), [3/2](1,2)) and nf '[5/2](2). For the intermediate states of 5s ', 7s ', and 8s, the np ' ([1/2](0) and [3/2](2)) series are observed with high intensity but not the np ' ([1/2](1) and [3/2](1)) series when the polarization vectors of two light beams are in parallel; but when they are in orthogonal, the np '[1/2](0) series disappears, the np '[3/2](2) intensity remains, and the np ' ([1/2](1) and [3/2](1)) series show up strongly. The intensity distribution of the np ' series strongly depends on the intermediate state. The spectra of the np ' series are assigned according to their intensity variation with the polarization vectors. The quantum defects determined for the series np '[1/2](0)(n=11-57), np '[312](2)(n=11-65), np '[3/2](1)(n=11-31), and nf '[5/2](2)(n=9-74) are 1.611 +/- 0.011, 1.683 +/- 0.013, 1.688 +/- 0.010, and 0.016 +/- 0.005, respectively. Our values are in excellent agreement with theoretical prediction. The spectral line shapes of autoionizing Rydberg states are analyzed with a Beutler-Fano profile. Reduced autoionization linewidths for the np '[1/2](0)(n= 11-16) series vary in the range 2549-4145 cm(-1), and the nf '[5/2](2)(n=9-11) series in 186-247 cm(-1) in reasonable agreement with theoretical prediction.
Growth competition between layer-type and porous-type Cu3Sn in microbumps
(2017-12-01)
Chu, David T.
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Chu, Yi-Cheng
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Lin, Jie-An
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Chen, Yi-Ting
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Wang, Chun-Chieh
Experimental study of growth competition between the co-existing layer-type and porous-type Cu3Sn in solder microbumps of Cu/SnAg/Cu is reported. The thickness of the SnAg solder is about 14 pm and the Cu column on both sides is 20 pm. Upon wetting-reflow, the solder is reacted completely to form Cu Sn iptermetallic compounds in a multi-layered structure of Cu/Cu3Sn/Cu6Sn5/Cu3Sn/Cu. Upon further annealing at 220 degrees C and 260 C, we obtain Cu/Cu3Sn/porous Cu3Sn/Cu3Sn/Cu, in which both types of Cu3Sn co-exist and form an interface. In the layer-type growth, we assume Cu to be the dominant diffusing species, coming from the Cu column. The Cu reacts with Cu6Sn5 to grow the Cu3Sn layer. In the porous-type growth, we assume Sn to be the dominant diffusing species, coming from the depletion of Sn in Cu6Sn5. The depleted Cu6Sn5 transforms to the porous-type Cu3Sn. At the same time, the Sn diffuses to the side-wall of Cu column to form a coating of Cu3Sn. Experimental observations of 3-dimensional distribution of voids in the porous-type Cu3Sn are performed by synchrotron radiation tomography; the voids are interconnected for the out-diffusion of Sn. The competing growth between the layer-type and the porous-type Cu3Sn is analyzed. (C) 2017 Elsevier Ltd. All rights reserved.
PROCESS DEVELOPMENT OF LOW RESISTIVE Ag-BASED THROUGH SILICON VIAS USING INKJET PRINTING TECHNIQUE FOR 3D MICROSYSTEM INTEGRATION
(2019-01-01)
Yang, Jia-Han
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Tsou, Kun-Lin
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Fu, Yu-Min
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Cheng, Yu-Ting
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Song, Yen-Fang
This paper presents an inkjet printing and filling process to produce 250 mu m deep Ag-based fully filled through silicon vias with the aspect ratio of via depth vs. diameter up to 5. With the optimization of the printing pattern, humidity control, and silver mirror reaction, the Ag TSV subjected to 400 degrees C thermal anneal for 60 mins can exhibit a resistivity of 26 mu Omega.cm, the lowest resistivity and highest AR ever reported. Process simplicity and no need of metal liners make the technique with great potential for 3D microsystem integration.
Structural characterization of colloidal crystals and inverse opals using transmission X-ray microscopy
(2014-07-15)
Huang, Bo-Han
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Wang, Chun-Chieh
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Liao, Chen-Hong
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Wu, Pu-Wei
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Song, Yen-Fang
A nondestructive tomographic technique was used to determine the crystallographic information of colloidal crystals comprising of polystyrene (PS) microspheres, as well as their silver inverse opals. The properties of the colloidal crystals, such as defects, grain size, grain boundaries, stacking sequence, and grain orientation, were determined using the full field transmission X-ray microscopy (TXM) with a spatial resolution of 50 nm. The PS microspheres (500-750 nm) which underwent a vertical electrophoresis process to form a face-centered cubic (fcc) close-packed structure with an ABCABC packing sequence. In addition, the colloidal crystal exhibited multiple grains, and an orientation variation of 6.1 degrees in the stacking direction between two neighboring grains. (C) 2014 Elsevier Inc. All rights reserved.