Browsing by Author "Sze, Jyh-Rou"

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Designs for optimizing depth of focus and spot size for UV laser ablation
(2010-11-01)
Wei, An-Chi
;
Sze, Jyh-Rou
;
Chern, Jyh-Long
;
光電工程學系
;
Department of Photonics
The proposed optical systems are designed for extending the depths of foci (DOF) of UV lasers, which can be exploited in the laser-ablation technologies, such as laser machining and lithography. The designed systems are commonly constructed by an optical module that has at least one aspherical surface. Two configurations of optical module, lens-only and lens-reflector, are presented with the designs of 2-lens and 1-lens-1-reflector demonstrated by commercially optical software. Compared with conventional DOF-enhanced systems, which required the chromatic aberration lenses and the light sources with multiple wavelengths, the proposed designs are adapted to the single-wavelength systems, leading to more economical and efficient systems.
Designs for optimizing depth of focus and spot size for UV laser ablation
(2010-11-01)
Wei, An-Chi
;
Sze, Jyh-Rou
;
Chern, Jyh-Long
;
光電工程學系
;
Department of Photonics
The proposed optical systems are designed for extending the depths of foci (DOF) of UV lasers, which can be exploited in the laser-ablation technologies, such as laser machining and lithography. The designed systems are commonly constructed by an optical module that has at least one aspherical surface. Two configurations of optical module, lens-only and lens-reflector, are presented with the designs of 2-lens and 1-lens-1-reflector demonstrated by commercially optical software. Compared with conventional DOF-enhanced systems, which required the chromatic aberration lenses and the light sources with multiple wavelengths, the proposed designs are adapted to the single-wavelength systems, leading to more economical and efficient systems.
LEDs on curved ceramic substrate with primary optics for modification of luminous intensity
(2011-01-01)
Wei, An-Chi
;
Sze, Jyh-Rou
;
Chern, Jyh-Long
;
光電工程學系
;
Department of Photonics
Unlike the conventional LED luminary with a planar substrate and only the forward emission, the proposed LED luminary with a curved ceramic substrate can perform both the forward and the backward emissions. Assembled with the proper primary optics, an illustrated LED bulb has been designed, fabricated and measured. The measured luminous intensity of the LED bulb has shown the backward emission and designed distribution with the beam-angle of 133. To broaden the application areas, such a LED bulb on a curved substrate has been modularized as a streetlight. The measured results of the proposed streetlight have shown that the beam angle of the luminous intensity and the luminaire efficiency are 132 degrees and 86%, respectively. Meanwhile, its luminous characteristics also fit the standard for lighting design of urban roads.
Light-emitting diodes on curved ceramic substrate with primary optics for modification of luminous intensity
(2012-04-20)
Wei, An-Chi
;
Sze, Jyh-Rou
;
Chern, Jyh-Long
;
光電工程學系
;
Department of Photonics
Unlike the conventional light-emitting diode (LED) luminaire with a planar substrate and only the forward emission, the proposed LED luminaire with a curved ceramic substrate can perform both the forward and the backward emissions and inherits the merits of good heat-dissipation and low cost from the ceramic substrate. Assembled with the proper primary optics, an illustrated LED bulb has been designed, fabricated and measured. The measured luminous intensity of the LED bulb has shown the backward emission and designed distribution with the beam-angle of 133 deg. To broaden the application areas, such a LED bulb on a curved substrate has been modularized as a streetlight. The measured results of the proposed streetlight have shown that the beam angle of the luminous intensity and the luminaire efficiency are 132 deg and 86%, respectively. Meanwhile, its luminous characteristics also fit the Chinese standard for lighting design of urban roads. (c) 2012 Society of Photo-Optical Instrumentation Engineers (SPIE). [DOI: 10.1117/1.JPE.2.026501]
Real-time Image Data Acquisition and Inspection System for Integrated Circuit Wafer after Sawing Process
(2016)
Lin, Chun-Fu
;
Fang, Hong-Ren
;
Sze, Jyh-Rou
;
Lin, Sheng-Fuu
;
Hwang, Chi-Hung
The major defect in integrated circuit wafers after the sawing process is the unexpected cracking from the sawing lane that damages the die area. Traditional defect detection algorithms for integrated circuit wafers after the sawing process can be divided into two parts. The first part is locating the sawing lane area and the second is detecting defects in the sawing lane area. The traditional methods take too long to locate the sawing lane area. To overcome this, this paper proposes a novel method for locating the sawing lane area using low-resolution and gray-value input images. After the sawing lane area is extracted from the original image, defects can be detected by traditional defect detection methods in the sawing lane area or by the method proposed in this paper. Using the proposed defect detection method is faster and better for real-time operation than traditional methods since the proposed method is more concise. Finally, a pioneering image data acquisition and inspection system for integrated circuit wafers after the sawing process is proposed in this paper. Furthermore, the proposed system works in real time because its architecture operates quickly and its proposed algorithm is simple, using low-resolution, gray-value images. Therefore, the proposed system can operate in real time and maintain a high-level detection rate.
Real-time Pitch Diameter Measurement of Internal Thread for Nut using Laser Triangulation
(2017-01-01)
Lin, Chun-Fu
;
Hwang, Chi-Hung
;
Fang, Hong-Ren
;
Chen, Chih-Yen
;
Sze, Jyh-Rou
In traditional industrial applications, the thread plug gauge is used to check the pitch diameter of the internal thread of a nut. However, the thread plug gauge can only be used to determine whether the nut was manufactured successfully rather than to measure the value of the pitch diameter. In recent years, several studies have employed a reflected light method such as laser triangulation to scan the outline of an object. However, most research studies using laser triangulation have developed measurement algorithms for specific objects because the properties of an object's appearance and the reflective laser from that object differ greatly. Existing algorithms are consequently not suitable for scanning the outline of the internal thread of a nut and measuring its pitch diameter with laser triangulation. In this paper, we propose a novel, real-time algorithm for measuring the pitch diameter of the internal thread of a nut using laser triangulation. First, a specific image preprocessing procedure designed for a reflective laser in the internal thread of a nut is presented. The result of preprocessing critically affects the measurement accuracy of the proposed method. Thereafter, we propose a measurement algorithm designed for the appearance properties of the internal thread of a nut. Our method can operate in real time because the proposed algorithm can measure the pitch diameter of the internal thread of a nut in only a few steps and simple calculations.
The Glass-Molding Process for Planar-Integrated Micro-Optical Component
(2011-01-01)
Huang, Chien-Yao
;
Sze, Jyh-Rou
;
Huang, Kuo-Cheng
;
Kuo, Chao-Hui
;
Tseng, Shih-Feng
This paper presents a precision glass-molding process to fabricate planar-integrated micro-optical components (PIMOC) applied to a micro projection display system, optical interconnection system and optical storage system. The PIMOC was designed based on wave propagation theory, and fabricated using a glass molding process. Experimental results are discussed in this article. The experiment showed that the PIMOC fabricated in a vacuum environment meets the design value with precision glass-molding technology (PGMT) at a molding force of 2.75 kN, a molding temperature of 750 degrees C and a cooling rate of 49 degrees C/min. (C) 2011 The Japan Society of Applied Physics