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Browsing by Author "TU King-Ning"

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    Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the Same
    (2013-05-16)
    CHEN Chih
    ;
    TU King-Ning
    ;
    LIU Taochi
    An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.
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    METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS
    (2013-02-14)
    CHEN Chih
    ;
    TU King-Ning
    ;
    HSIAO Hsiang-Yao
    The present invention relates to a method for inhibiting growth of intermetallic compounds, comprising the steps of: (i) preparing a substrate element including a substrate on which at least one layer of metal pad is deposited, wherein at least one thin layer of solder is deposited onto the layer of metal pad, and then carry out reflowing process; and (ii) further depositing a bump of solder with an appropriate thickness on the substrate element, characterized in that a thin intermetallic compound is formed by the reaction of the thin solder layer and the metal in the metal pad after appropriate heat treatment of the thin solder layer. In the present invention, the formation of a thin intermetallic compound is able to slow the growth of the intermetallic compound and to prevent the transformation of the intermetallic compounds.
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    SINGLE CRYSTAL COPPER, MANUFACTURING METHOD THEREOF AND SUBSTRATE COMPRISING THE SAME
    (2015-03-05)
    CHEN Chih
    ;
    TU King-Ning
    ;
    LU Chia-Ling
    The present invention relates to a single crystal copper having [100] orientation and a volume of 0.1˜4.0×106 μm3. The present invention further provides a manufacturing method for the single crystal copper and a substrate comprising the same.
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    SPECIMEN BOX FOR ELECTRON MICROSCOPE
    (2013-01-10)
    CHEN Chih
    ;
    TU King-Ning
    The present invention relates to a specimen box for an electron microscope, which comprises a first substrate, a second substrate, and a metal adhesion layer. The first substrate has a first surface, a second surface, a first concave, and one or more first through holes, wherein the first through hole penetrates through the first substrate. The second substrate has a third surface, a forth surface, and a second concave. Besides, the metal adhesion layer is disposed between the first substrate and the second substrate to form a space for a specimen placed therein. In addition, the specimen box of the present invention further comprises one or more plugs. When the plug is assembled into the first through hole to seal the specimen box, the in-situ observation can be accomplished by using an electron microscope.