Browsing by Author "Tai, WC"

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Design and fabrication of a three-dimensional long-stretch micro drive by electroplating
(2003)
Wu, CT
;
Tai, WC
;
Hsu, CP
;
Hsu, W
;
機械工程學系
Although lots of works have been devoted to develop the microactuators or microstructures, few researches have been done on three-dimensional microactuators. Here the feasibility investigation on a three-dimensional electrothermally driven long-stretch micro drive (LSMD) is proposed by integrating the LSMD and mechanical hinge mechanism. The LSMD (about 2000 mum x 500 mum) consists of two cascaded compliant structures in parallel. Each cascaded structure is formed by connecting several basic actuation units in series. The mechanical hinge is used to allow the LSMD to be lifted as a three-dimensional structure. One of the important issues in fabricating the three-dimensional microactuator is the conducting circuit to actuate the microactuator. Here the Ni electroplating process is used to fabricate the mechanical hinge structure and the LSMD, then the mechanical hinge itself can act as the conductive circuit easily. From the LSMD simulation results, several design parameters are found to have significant influence on the output displacements. Larger out-stretching displacements are feasible by proper choice of design parameters. Preliminary fabrication results of nickel-made LSMD exhibit output displacement of 190 mum at input voltage of 3 volts. Fabrication results of nickel-made three-dimensional LSMD are also presented.
Tdesign and fabrication of a three-dimensional long-stretch micro drive by electroplating
(2004)
Tai, WC
;
Wu, CT
;
Hsu, CP
;
Hsu, W
;
機械工程學系
Here a three-dimensional micoractuator is proposed by integrating an electro-thermal long stretch micro drive (LSMD) and mechanical hinge mechanism. The mechanical hinge is used to allow the LSMD to be lifted. One of the important issues in fabricating the lifted microactuator is the conducting circuit to actuate the microactuator. Here the electroplating process is used to fabricate the mechanical hinge structure and the LSMD, and then the mechanical hinge itself can act as the conductive circuit easily. The fabrication and testing result show that the three-dimensional LSMD of 2000 mum wide and 500 mum high can stand vertically with output displacement up to 56 mum at input voltage of 2 volts. However, it is found that the output displacement of three-dimensional LSMD is smaller than planar LSMD with substrate beneath due to the lacking of heat conduction at the same input voltage.