Browsing by Author "Tan, C. S."

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Integration schemes and enabling technologies for three-dimensional integrated circuits
(2011-05-01)
Chen, K. N.
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Tan, C. S.
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
Various integration schemes and key enabling technologies for wafer-level three-dimensional integrated circuits (3D IC) are reviewed and discussed. Stacking orientations (face up or face down), methods of wafer bonding (metallic, dielectric or hybrid), formation of through-silicon via (TSV) (via first, via middle or via last) and singulation level (wafer-to-wafer or chip-to-wafer) are options for 3D IC integration schemes. Key enabling technologies, such as alignment, Cu-Cu bonding and TSV fabrication, are described as well. Improved performance, such as lower latency and higher bandwidth, lower power consumption, smaller form factor, lower cost and heterogeneous integration of disparate functionalities, are made possible in the next generation of electronics products with the realisation of 3D IC.
Performance Optimization of Organic Solar Cells
(2014-08-01)
Wong, Y. Q.
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Wong, H. Y.
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Tan, C. S.
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Meng, H. F.
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物理研究所
Organic solar cells (OSCs) have been gaining great popularity in recent years due to their potentials to be low cost, lightweight, and flexible. The performance of OSCs is growing steadily, and they have achieved a power conversion efficiency close to 10% (for single-junction polymer-fullerene OSC). Although there are still limitations and challenges faced by the development of OSCs, in view of the potentials, recent studies have been focusing on the design optimization of OSC layer structure through material engineering, interfacial layer insertion, layer thickness optimization, and morphological control. In this paper, we provide a comprehensive review and detailed discussion on the optimization works and development on OSCs, with particular focus on the bulk-heterojunction (BHJ) polymer-fullerene OSCs. We also provide a summary of the performance, in a chronological order, and the future outlook of OSC.