Browsing by Author "Thoti, Narasimhulu"

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Effects of a dual spacer on electrical characteristics and random telegraph noise of gate-all-around silicon nanowire p-type metal-oxide-semiconductor field-effect transistors
(2020-04-01)
Kola, Sekhar Reddy
;
Li, Yiming
;
Thoti, Narasimhulu
;
交大名義發表
;
電機工程學系
Using a dual spacer consisting of 50% SiO2 and 50% HfO2, the ratio of the on-state current/the off-state current in the order of 10(6) is achieved for the explored devices. Based on the experimentally validated simulation, the result indicates that the variation of gate-capacitance is significant owing to the sizeable parasitic capacitance resulting from the spacer. The role of the spacer acts as the parallel plate capacitor, the amount of gate capacitance will be increased largely with the HfO2 due to its high parasitic capacitance. For the devices without any spacers, induced by a donor-type single charge trap (SCT), the statistically calculated highest amplitude of random telegraph noise (RTN) is 2.32%. It occurs when the SCT locates in the middle of the channel due to the high occurrence of capture and emission for SCT under low gate voltage. Notably, for devices with considerable spacers, the RTN can be significantly suppressed (<= 1%). (C) 2020 The Japan Society of Applied Physics
Random telegraph noise in gate-all-around silicon nanowire MOSFETs induced by a single charge trap or random interface traps
(2020-03-01)
Kola, Sekhar Reddy
;
Li, Miming
;
Thoti, Narasimhulu
;
交大名義發表
;
電機工程學系
The random telegraph noise (RTN) in gate-all-around (GAA) silicon (Si) nanowire (NW) metal-oxide-semiconductor field-effect transistors (MOSFETs) induced by a single charge trap (SCT) or random interface traps (RITs) is studied for the first time. An experimentally validated three-dimensional quantum-mechanically-corrected device simulation is advanced to investigate the explored devices. The magnitude of the RTN decreases with increasing gate voltage to different extents for the planar MOSFET, bulk FinFET, and GAA Si NW MOSFET devices, owing to the reduction in the conducting carriers along the channel. For the GAA Si NW MOSFET, the reduction of the fluctuation of threshold voltage in the presence of RITs is about 25 and 3 times when compared with the planar MOSFET and bulk FinFET device, respectively, whereas this reduction in the presence of an SCT is about 6 and 2.6 times, respectively. For the GAA Si NW MOSFET, the reduction of the RTN in the presence of RITs is about 7.5 and 4.7 times when compared with the planar MOSFET and bulk FinFET device, respectively, whereas this reduction in the presence of an SCT is about 22 and 6 times, respectively. At given threshold voltage, compared with the results for the planar MOSFETs and bulk FinFET, the GAA Si NW MOSFET exhibits minimal characteristic variability and RTN owing to the ultimate electrostatic control of the gate from the point of view of electrostatic integrity.