Browsing by Author "Tong, H. M."

Now showing 1 - 1 of 1

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
(2010)
Chen, Chih
;
Tong, H. M.
;
Tu, K. N.
;
材料科學與工程學系
;
Department of Materials Science and Engineering
Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging industry due to environmental concerns. Both electromigration (EM) and thermomigration (TM) have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. We review the unique features of EM and TM in flip-chip solder bumps, emphasizing the effects of current crowding and joule heating. In addition, the challenges to a better understanding of EM and TM in Pb-free solders are discussed. For example, the anisotropic nature of Sn microstructure in Pb-free solders can enhance the dissolution rates of Ni and Cu in solders driven by EM and TM.