Browsing by Author "Tsai, Chi-Chong"

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A Novel Cost Effective Double Reduced Surface Field Laterally Diffused Metal Oxide Semiconductor Design for Improving Off-State Breakdown Voltage
(2012-04-01)
Han, Ming-Hung
;
Chen, Hung-Bin
;
Chang, Chia-Jung
;
Wu, Jia-Jiun
;
Chen, Wen-Chong
In this work, double reduced surface field (RESURF) laterally diffused metal oxide semiconductor (LDMOS) device combines a new implant technology without using additional mask in standard 0.18 mu m technology has been proposed and successfully fabricated. The breakdown voltage (BV) can be improved significantly with simply changing the implanted region length in this implant technology. Firstly, hydrodynamic transport simulations which analyze the high bias condition electric field distributions are examined to predict and explain the increase of breakdown voltage. Then the fabricated devices process flow is demonstrated, the structures are performed, and the breakdown voltages increase with different n-type double diffusion (NDD) photoresistor (PR) size using the change of PR exposure dose are investigated. The measurement results show that maximum NDD PR size achieves BV improvement of 6.3%, and 5% increase of figure of merit (FOM) evaluation. Throughout the whole fabrication process, no additional mask and device area show the potential of cost effective with the proposed technique. Such devices with good off-state breakdown voltage and specific on-resistance are very competitive with similar technologies and show good promising in system on chip (SOC) applications. (C) 2012 The Japan Society of Applied Physics
Improving Breakdown Voltage of LDMOS Using a Novel Cost Effective Design
(2013-05-01)
Han, Ming-Hung
;
Chen, Hung-Bin
;
Chang, Chia-Jung
;
Tsai, Chi-Chong
;
Chang, Chun-Yen
A reduced surface field (RESURF) laterally diffused metal oxide semiconductor (LDMOS) device with the concept of charge compensation using p-implant layer (PIL) without additional process step is proposed in standard 0.18-mu m technology. By simply using the p-type drift drain (PDD) implantation of p-type LDMOS into n-type LDMOS, breakdown voltage (VBD) is substantially improved. For a thorough study of device phenomena, hydrodynamic transport simulations are first performed to analyze the electric field distributions at high voltage bias in order to explain increases in breakdown voltage and predict its optimal design parameter. Then fabrication of the devices is performed and shows that the breakdown voltages increase significantly. The measurement results show a 12% improvement in VBD and a 5% improvement in figure of merit (FOM). Throughout the fabrication process, the enlarged breakdown voltage obtained by the PIL without additional process and device area show the potential of cost effective. Because such devices have good off-state breakdown voltage and specific on-resistance, they are very competitive with similar technologies and promising system-on-chip (SOC) applications.