Browsing by Author "Tseng, BC"

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A fast algorithm for computing field radiated by an insulated dipole antenna in dissipative medium
(1996-12-01)
Wu, LK
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Su, DWF
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Tseng, BC
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交大名義發表
;
傳播研究所
A fast algorithm for determining the near-field characteristics of an insulated dipole antenna (IDA) embedded in a homogenous dissipative medium is described in this paper. A thin-wire-approximation type of analysis is followed here. In this case, radiation is considered to originate from a filamentary current flowing along the axis of the dipole, which is surrounded immediately hy the ambient dissipative medium, The translational symmetry inherent in the resultant radiation integrals is then exploited to speed up the computation. In one case studied, the basic thin-wire approach that uses no symmetry property is found to yield accurate results in approximately 380 times less CPU time than the traditional King-Casey approach, In another case, use of symmetry property further reduces the CPU time by a factor of 7; additional reduction in CPU time is possible by taking into account the near-field nature of the problem.
Design of miniaturized common-mode filter by multilayer low-temperature co-fired ceramic
(2004-11-01)
Tseng, BC
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Wu, LK
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傳播研究所
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Institute of Communication Studies
A miniaturized common-mode filter composed of multiple substrates with positive and negative coils formed on alternate substrates is proposed in this paper. The pattern of each positive coil is interlaced with that of each negative coil, whereby when the positive and negative coils are alternately stacked, the positive coil do not overlap the negative coil. With such offset configuration, the parasitic capacitance introduced between positive and negative traces is reduced, so the thickness of each substrate can be decreased and the size of the entire filter is effectively reduced. Good agreements between simulated and measured results are demonstrated. Further, the effectiveness of this filter is confirmed by eye diagram and radiation emission measurements.
Embedded passive components for printed-circuit boards
(1999)
Wu, LK
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Tseng, BC
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Liao, LC
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電信工程研究所
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Institute of Communications Engineering
Demand for significant size reduction of circuitry used to build various portable products has increased rapidly in recent years. While significant strides have been made in the integration of active components, only little progress has been made in the integration of passive components. Together with the increasing circuit complexities to meet the increasing demand on a product's functionality, number of passive components used in a typical portable product has increased significantly in recent years and may account for 70-80% of the total part count. The embedded passives technology that was developed recently is aimed at integrating various passive components at the printed-circuit board level. By integrating these passives, manufacturers may obtain the following advantages: (1) a dramatic reduction in the overall part count, (2) improved wireability due to the elimination of vias, (3) improved reliability due to the elimination of solder joints, and (4) improved frequency response due to the elimination of parasitic inductance.
Integral passives in multi-dielectric substrate
(2000)
Wu, LK
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Tseng, BC
;
Liao, LC
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電信工程研究所
;
Institute of Communications Engineering
Integral passives technology has the potential for achieving denser packaging, more efficient manufacturing processes, better reliability and future replacement of many surface mount devices which will result in savings of volume, mass and cost To improve the circuit performance and obtain greater benefits of the integral passives, multi-dielectric substrates with layer-specific dielectric constant and thickness can be used to design the integral passives. With these different material characteristics we design various integral capacitors in a 6-layer printed wiring boards and then extract various circuit parameters associate with the frequency-dependent equivalent circuit models. From which a comparison between the experimentally measured characteristics and the simulated results of an RF amplifier will be demonstrated.