Browsing by Author "Tseng, Bae-Heng"

Now showing 1 - 7 of 7

A fabrication of germanium nanocrystal embedded in silicon-oxygen-nitride layer
(2006)
Tu, Chun-Hao
;
Chang, Ting-Chang
;
Liu, Po-Tsun
;
Liu, Hsin-Chou
;
Weng, Chi-Feng
The formation of germanium nanocrystals embedded in silicon-oxygen-nitride (SiON) layer acting as distributed charge storage elements is proposed in this work. A large memory window is observed due to the isolated Ge nanocrystals in the SiON gate stack layer. The Ge nanocrystals were nucleated after the high-temperature oxidation of SiGeN layer. The nonvolatile memory device with the Ge nanocrystals embedded in SiON stack layer exhibits 4 V threshold voltage shift under 7 V write operation. Also, the sequent high-temperature oxidation of the SiGeN layer acting as the blocking oxide is proposed to enhance the performance of nonvolatile memory devices. (c) 2006 The Electrochemical Society.
A novel nanowire channel poly-Si TFT functioning as transistor and nonvolatile SONOS memory
(2007-09-01)
Chen, Shih-Ching
;
Chang, Ting-Chang
;
Liu, Po-Tsun
;
Wu, Yung-Chun
;
Lin, Po-Shun
In this letter, a polycrystalline silicon thin-film transistor consisting of silicon-oxide-nitride-oxide-silicon (SONOS) stack gate dielectric and nanowire (NW) channels was investigated for the applications of transistor and nonvolatile memory. The proposed device, which is named as NW SONOS-TFT, has superior electrical characteristics of transistor, including a higher drain current, a smaller threshold voltage (V-th), and a steeper subthreshold slope. Moreover, the NW SONOS-TFT also can exhibit high program/erase efficiency under adequate bias operation. The duality of both transistor and memory device for the NW SONOS-TFT can be attributed to the trigate structure and channel corner effect.
Bipolar Resistive RAM Characteristics Induced by Nickel Incorporated Into Silicon Oxide Dielectrics for IC Applications
(2012-12-01)
Tsai, Tsung-Ming
;
Chang, Kuan-Chang
;
Chang, Ting-Chang
;
Syu, Yong-En
;
Chuang, Siang-Lan
In this letter, we successfully produced resistive switching behaviors by nickel doped into silicon oxide at room temperature. The nickel element was doped into silicon oxide, which is a useful dielectric material in integrated circuit (IC) industries by cosputtering technology. Based on the proposed method, satisfactory reliability of the resistance switching device can be demonstrated by endurance and retention evaluation. We believe that the silicon oxide doped with nickel at room temperature is a promising method for resistive random access memory nonvolatile memory applications due to its compatibility with the IC processes.
Characteristics of hafnium oxide resistance random access memory with different setting compliance current
(2013-10-14)
Su, Yu-Ting
;
Chang, Kuan-Chang
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Chang, Ting-Chang
;
Tsai, Tsung-Ming
;
Zhang, Rui
In this Letter, the characteristics of set process of hafnium oxide based resistance random access memory are investigated by different set processes with increasing compliance current. Through current fitting, carrier conduction mechanism of low resistance state changes from hopping to surface scattering and finally to ohmic conduction with the increase of setting compliance current. Experimental data of current-voltage measurement under successive increasing temperature confirms the conduction mechanism transition. A model of filament growth is eventually proposed in a way by merging discrete metal precipitates and electrical field simulation by COMSOL Multiphysics further clarifies the properties of filament growth process. (C) 2013 AIP Publishing LLC.
Dehydroxyl effect of Sn-doped silicon oxide resistance random access memory with supercritical CO2 fluid treatment
(2012-09-10)
Tsai, Tsung-Ming
;
Chang, Kuan-Chang
;
Chang, Ting-Chang
;
Syu, Yong-En
;
Liao, Kuo-Hsiao
The tin-doped can supply conduction path to induce resistance switching behavior. However, the defect of tin-doped silicon oxide (Sn:SiOx) increased the extra leakage path lead to power consumption and joule heating degradation. In the study, supercritical CO2 fluids treatment was used to improve resistive switching property. The current conduction of high resistant state in post-treated Sn:SiOx film was transferred to Schottky emission from Frenkel-Poole due to the passivation effect. The molecular reaction model is proposed that the defect was passivated through dehydroxyl effect of supercritical fluid technology, verified by material analyses of x-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4750235]
Performance and characteristics of double layer porous silicon oxide resistance random access memory
(2013-06-24)
Tsai, Tsung-Ming
;
Chang, Kuan-Chang
;
Zhang, Rui
;
Chang, Ting-Chang
;
Lou, J. C.
A bilayer resistive switching memory device with an inserted porous silicon oxide layer is investigated in this letter. Compared with single Zr:SiOx layer structure, Zr: SiOx/ porous SiOx structure outperforms from various aspects, including low operating voltages, tighter distributions of set voltage, higher stability of both low resistance state and high resistance state, and satisfactory endurance characteristics. Electric field simulation by COMSOL (TM) Multiphysics is applied, which corroborates that intensive electric field around the pore in porous SiOx layer guides the conduction of electrons. The constraint of conduction path leads to better stabilization and prominent performance of bilayer resistive switching devices. (C) 2013 AIP Publishing LLC.
The growth of heteroepitaxial CuInSe2 on free-standing N-polar GaN
(2014-12-01)
Shih, Cheng-Hung
;
Lo, Ikai
;
You, Shuo-Ting
;
Tsai, Cheng-Da
;
Tseng, Bae-Heng
We report that chalcopyrite CuInSe2 thin films were grown on free-standing N-polar GaN (000 (1) over bar) by molecular beam epitaxy. X-ray diffraction showed that the CuInSe2 thin film was grown in (112) orientation, and its peak of rocking curve with full width at half maximum of about 897.8 arc-sec indicated the epitaxial growth of CuInSe2 (112) film on N-polar GaN. Microstructure analysis of the CuInSe2 showed that the large lattice mismatch (28.5%) between CuInSe2 and GaN is accommodated by domain matching, and no interface reaction occurs between CuInSe2 and GaN. Our experimental results show that GaN is stable for the epitaxial growth of CuInSe2 thin film, which exhibits a promising potential for optoelectronic applications. (C) 2014 Author(s).