Browsing by Author "Tsou, Kun-Lin"

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A FlexibleWO(3)-Based pH Sensor Array for 2-D pH Monitoring Using CPLoP Technique
(2018-06-01)
Fu, Yu-Min
;
Pan, Jia-Chyi
;
Tsou, Kun-Lin
;
Cheng, Yu-Ting
;
電子工程學系及電子研究所
In this letter, we demonstrate an inkjet-printed WO3-based pH sensor array using WO3/Ag and Ag/AgCl as working and reference electrodes, respectively, on a flexible polyimide substrate. Pre-treated by Tollen's reagent, the printed Ag lines as sensor interconnects can exhibit a denser microstructure with lower electrical resistivity. As a result, the WO3 nanoparticles can be well printed and sintered at 120 degrees C on the Ag lines as the working electrodes of the pH sensors. Experimental results show the sensitivity of the pH sensor to be as high as -24.4 mV/pH. The array comprising six pH sensors shows potential for real-time 2-D pH sensing applications.
PROCESS DEVELOPMENT OF LOW RESISTIVE Ag-BASED THROUGH SILICON VIAS USING INKJET PRINTING TECHNIQUE FOR 3D MICROSYSTEM INTEGRATION
(2019-01-01)
Yang, Jia-Han
;
Tsou, Kun-Lin
;
Fu, Yu-Min
;
Cheng, Yu-Ting
;
Song, Yen-Fang
This paper presents an inkjet printing and filling process to produce 250 mu m deep Ag-based fully filled through silicon vias with the aspect ratio of via depth vs. diameter up to 5. With the optimization of the printing pattern, humidity control, and silver mirror reaction, the Ag TSV subjected to 400 degrees C thermal anneal for 60 mins can exhibit a resistivity of 26 mu Omega.cm, the lowest resistivity and highest AR ever reported. Process simplicity and no need of metal liners make the technique with great potential for 3D microsystem integration.